Swissbit introduces industrial grade 3D-NAND-SSD

3D-NAND-based SSD’s are common in consumer markets. Swissbit now introduces a range of 3D-NAND-SSD products that are specifically optimized for demanding industrial- and NetCom applications. The...


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Contents Highlights

  • AI: it is still early days
  • Connectors: Rugged and Reliable / Single-Pair Ethernet
  • Power Electronics: Next-Gen Power Strategies, GaN, SiC, ...
  • Embedded Systems: Motion Control, SBC, SOMs, IoT

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EKF: CompactPCI Serial to CompactPCI Classic bridge

EKF introduces the SXP-JAM, a backplane bridge for CompactPCI Serial systems with need for integrating CompactPCI Classic cards. The SXP-JAM is a dual card assembly, which expands a modern CompactPCI ...

SEGGER adds video to emUSB-device

SEGGER introduces video class (UVC) support for emUSB-Device. An Embedded System with a USB device interface can now enumerate as a video camera. Once connected to a Host (Windows, Mac, Linux or Table...


eBOOK: The future of power!

  • PCIM Europe: The future of power!
  • Power Management: Solving the Heat Challenge
  • The Future of Power Applications
  • Modular control device platform for concept
  • SiC enabling EV applications

AAEON: BOXER-8150AI, AI at the speed of sight

AAEON announces the BOXER-8150AI, the latest in the BOXER-8100AI family of compact embedded AI Edge solutions powered by NVIDIA Jetson TX2. Featuring eight USB 3.0 ports, the BOXER-8150AI is designed ...


Virtual Conference: Technical Trends with Wide Bandgap Semiconductors

We are facing higher switching frequency and higher operating temperatures. Wide Band Gap Semiconductors can accommodate these increasing demands by permitting better performance than today’s silicon. Passive components from heat sinks, capacitors and coils get smaller. The overall benefit is reduced sizes for the total systems in all applications. However, the challenges are having improved measurement equipment available and to analyze the designs correctly.


AAEON: RoboMaker Developer Kit for AWS RoboMaker

UP Bridge The Gap, a brand belonging to AAEON Technology Europe, announce its UP Squared RoboMaker Developer Kit for AWS RoboMaker powered by Intel AI technology and Amazon Web Services (AWS). This ef...

nVent Schroff at Embedded World 2019

The theme of the nVent Schroff booth at Embedded World 2019 was “Experience Expertise – Modularity, Performance, Protection and Design”. Join us as our experts give an overview of th...


Garz & Fricke Interview at Embedded World 2019 with Dr. Arne Dethlefs: We are strengthening our presence in North America

Through its US subsidiary, located in Minnesota, Garz & Fricke is providing support for its growing HMI and Panel-PC business in the USA and Canada while also strengthening its presence in North A...


SECO's innovations at embedded world 2019

In a much larger stand than in previous years, at embedded world 2019 SECO showcases its wide range of solutions and services for the industrial domain and IoT. Among the main innovations, in this vid...


Design and Manufacturing Services at Portwell

Since about two years Portwell is part of the Posiflex Group. Together with KIOSK, the US market leader in KIOSK systems, the Posiflex Group is a strong player in the Retail, KIOSK and Embedded market...


Arrow capabilities in design support

Florian Freund, Engineering Director DACH at Arrow Electronics talks us through Arrow’s transformation from distributor to Technology Platform Provider and how Arrow is positioned in both, Custo...


Arm launches PSA Certified to improve trust in IoT security

Arm’s Platform Security Architecture (PSA) has taken a step forward with the launch of PSA Certified, a scheme where independent labs will verify that IoT devices have the right level of securit...


DIN-Rail Embedded Computers from MEN Mikro

The DIN-Rail system from MEN is a selection of individual pre-fabricated modules that can variably combine features as required for a range of embedded Rail Onboard and Rail Wayside applications. The ...


Embedded Graphics Accelerates AI at the Edge

The adoption of graphics in embedded and AI applications are growing exponentially. While graphics are widely available in the market, product lifecycle, custom change and harsh operating environments...


ADLINK Optimizes Edge AI with Heterogeneous Computing Platforms

With increasing complexity of applications, no single type of computing core can fulfill all application requirements. To optimize AI performance at the edge, an optimized solution will often employ a...


Synchronized Debugging of Multi-Target Systems

The UDE Multi-Target Debug Solution from PLS provides synchronous debugging of AURIX multi-chip systems. A special adapter handles the communication between two MCUs and the UAD3+ access device and pr...


Smart Panel Fulfills Application Needs with Flexibility

To meet all requirement of vertical applications, ADLINK’s Smart Panel is engineered for flexible configuration and expansion to reduce R&D time and effort and accelerate time to market. The...


Artificial Intelligence

Morten Kreiberg-Block, Director of Supplier & Technology Marketing EMEA at Arrow Electronics talks about the power of AI and enabling platforms. Morten shares some examples of traditional designin...


Arrow’s IoT Technology Platform – Sensor to Sunset

Andrew Bickley, Director IoT EMEA at Arrow Electronics talks about challenges in the IoT world and how Arrow is facing those through the Sensor to Sunset approach. Over the lifecycle of the connected ...


AAEON – Spreading Intelligence in the connected World

AAEON is moving from creating the simple hardware to creating the great solutions within Artificial Intelligence and IoT. AAEON is offering the new solutions for emerging markets, like robotics, drone...


Arrow as a Technology Provider drive Solutions selling approach

Amir Sherman, Director of Engineering Solutions & Embedded Technology at Arrow Electronics talks about the transition started couple of years ago from a components’ distributor to Technology...


Riding the Technology wave

David Spragg, VP, Engineering – EMEA at Arrow Electronics talks about improvements in software and hardware enabling to utilize the AI capabilities. David shares how Arrow with its solutions is ...


ASIC Design Services explains their Core Deep Learning framework for FPGA design

In this video Robert Green from ASIC Design Services describes their Core Deep Learning (CDL) framework for FPGA design at electronica 2018 in Munich, Germany. CDL technology accelerates Convolutional...


Microchip explains some of their latest smart home and facility solutions

In this video Caesar from Microchip talks about the company's latest smart home solutions at electronica 2018 in Munich, Germany. One demonstrator shown highlights the convenience and functionalit...


Infineon explains their latest CoolGaN devices at electronica 2018

In this video Infineon talks about their new CoolGaN 600 V e-mode HEMTs and GaN EiceDRIVER ICs, offering a higher power density enabling smaller and lighter designs, lower overall system cost. The nor...


Analog Devices demonstrates a novel high-efficiency charge pump with hybrid tech

In this video Frederik Dostal from Analog Devices explains a very high-efficiency charge-pump demonstration at their boot at electronica 2018 in Munich, Germany. Able to achieve an operating efficienc...


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