congatec presents roadmap for SMARC 2.0, Qseven 2.1 and COM Express 3.0
congatec announced at Embedded World that it fully supports the upcoming new SGET and PICMG Computer-on-Module specifications SMARC 2.0, Qseven 2.1 and COM Express 3.0. Modules complying with these standards are already in development and will be announced in time with the launch of the next processor generations. congatec will fully support the SMARC 2.0 specification. SMARC 2.0 modules will become available for the full range of relevant processor technologies – from the Intel Atom processor to various ARM designs. congatec continues to support all current low-power processors for Qseven 2.1 designs as well.
The essential difference between the two standards is the number of supported interfaces with Qseven providing up to 230, and SMARC 2.0 up to 314 pins. SMARC is intended to interface richer systems with the smallest footprints; while Qseven is ideal for slimmer and less complex module and carrier board designs.
congatec has played a significant and active role in the development of all standards. For the Qseven and SMARC specifications congatec even assumed the role of editor and is consequently a key technology provider for highly compact SFF designs based on Computer-on-Modules.
COM Express 3.0 will primarily offer a new pinout type specifically for Server-on-Modules. The server-focused Intel Xeon and Intel Core processors as well as the AMD Embedded R-Series processors are prime targets, with ARM based platforms another possible option.
With congatec’s personal integration service, developers will find it easy to integrate the new revisions into future system designs. Since most features are backward compatible, it is in many cases possible to upgrade existing carrier boards with new modules. This gives OEMs investment protection for existing system designs.