ADLINK: compact fanless embedded computers with 6th gen Intel Core
ADLINK Technology announced the release of its new Matrix MXE-5500 Series, featuring 6th generation Intel Core i7/i5/i3 processors (code name Skylake), and delivering outstanding performance with robust construction, rich I/O, and easy device access, all in a compact package. The MXE-5500 Series sustains reliable performance at -20 to 70C°, shock up to 100G, and vibration up to 5Grms, making it an optimal solution for ITS, surveillance, and industrial and logistic automation applications. Moreover, AFM (adaptive function module) capability offers fast application-specific access for medium volume operations, reducing development time by up to 50%.
ADLINK’s MXE-5500 Series, equipped with 6th Generation Intel Core i7-6820EQ/i5-6440EQ/i3-6100E processors, boosts computing power by up to 30% over previous generation CPUs, delivers 30% faster graphics performance, and provides accelerated HW media codecs to support Ultra HD 4K display. Dual-channel DDR4 2133 MHz SO-DIMM sockets support up to 32 GB of memory, and the Series’ compact footprint is perfect for deployment in limited-space environments such as in-vehicle infotainment and CCTV applications.
The MXE-5500 Series simplifies ownership tasking such as installation and maintenance with single-side access I/O featuring 2x DisplayPort + DVI-I, 4x GbE, 6x COM, 4x USB 3.0+4x USB 2.0, and 8x isolated DI/O. Storage options are also extremely flexible with 2x 2.5“ hot-swappable SATA III, 1x M.2 2280, and 1x CFast w/ RAID support, easing storage maintenance burdens. ADLINK's built-in SEMA™ (smart embedded management agent) utility provides an intuitive GUI and easy-to-use programming library for enhanced system management. The MXE-5500 kicks up flexibility with maximum reliability for storage utilization and function expansion.
ADLINK’s MXE-5500 and MXE-1400 embody uniquely adaptive function module fulfilment for operations requiring fast customization, meeting demands for modular design with application oriented I/O and domain-specific power supply.
Reusable cross-generation compatibility and cross-platform (Atom/Core processor) functionality for scalability together simplify development challenges, thereby reducing Time to Market and TCO.