ADLINK: COM Express 3.0 type 7 Computer-on-Module
ADLINK Technology announced its first computer-on-module based on the latest PCI Industrial PICMG COM Express 3.0 specification with new Type 7 pinout, for which ADLINK lead development efforts to bring a server-grade platform and 10 GbE capabilities to a COM form factor. ADLINK’s Express-BD7 targets customers building space-constrained systems in industrial automation and data communication, such as virtualization, edge computing or other numerical applications, that require high density CPU cores balanced by reasonable power consumption.
The COM Express standard’s new Type 7 pinout, as compared to the Type 6 pinout, does away with all graphics support and replaces it with up to four 10GbE ports and an additional eight PCIe ports, bringing the total PCIe support to up to 32 PCIe lanes. The Type 7 pinout has been specifically tailored leveraging all the functions of low power, headless server-grade SoCs with a TDP below 65 Watts. The Intel Xeon SoCs featured in ADLINK’s Express-BD7support up to 16 CPU processor cores, 32 PCIe lanes, and multiple 10GbE ports. In addition, the Type 7 pinout brings out 10GBase-KR signals, meaning the carrier board designer can choose between KR-to-KR, KR-to-optical fiber or KR-to-copper. A Network Controller Sideband Interface bus is also supported, allowing for Intelligent Platform Management Interface Board Management Controller support on the carrier board.
ADLINK is playing a leading role in the PICMG subcommittee that is currently defining the new Com Express 3.0 specification. The committee, which started its work late 2015, is chaired by ADLINK's Jeff Munch, CTO of Americas, and has just published a preview of the new specification. The preview defines the new Type 7 pinout and allows module manufacturers and customers to start designs before the full specifications are published, which is expected to be the end of Q3 2016.
ADLINK’s Express-BD7 provides up to 32GB dual channel DDR4 at 1867/2133/2400MHz ECC (dependent on SoC SKU), up to eight PCIe x1 (Gen2), two PCIe x4, one PCIe x16 (Gen3), two SATA 6 Gb/s and four USB 3.0/2.0. The module comes with a build option for an Extreme Rugged operating temperature range of -40 to +85°C and supports ADLINK Smart Embedded Management Agent, which enables remote management and control of distributed devices.
ADLINK's SEMA-equipped devices connect seamlessly to our SEMA Cloud solution to enable remote monitoring, autonomous status analysis, custom data collection and initiation of appropriate actions. All collected data, including sensor measurements and management commands, are available from any place, at any time via encrypted data connection.