congatec: Qseven and COM Express modules with Apollo Lake processor
congatec has released new COM Express Compact and Qseven Computer-on-Modules in time with the launch of Intel's new low-power processors (code name Apollo Lake). The modules with Intel Atom, Celeron and Pentium processors feature the powerful Intel Gen 9 graphics and deliver an impressive performance per watt improvement, enabling the implementation of even more powerful designs with even lower energy consumption. This, combined with long-term availability of 10 years, makes the new high-end low-power modules a perfect fit for both entry level COM Express Compact designs and high-end Qseven platforms.
The new real-time capable congatec Qseven and COM Express Compact modules come with particularly energy-saving Intel Atom processors E3930, E3940 and E3950 for the industrial-grade extended temperature range of -40 to +85° C, or are fitted with the more powerful low-power dual-core Intel Celeron N3350 and quad-core Intel Pentium N4200 processors. A highlight is that the industrial-grade module variants with Intel Atom processors have a lidded cooling interface which connects directly to the processor. Therefore, no additional copper heat stack is required for most simple implementations and heat dissipation. All modules host the high-performance Intel Gen 9 graphics which provides up to 18 execution units and supports up to 4k decode and encode capabilities for HEVC4, H.264, VP8, SVC and MVC.
Hosting up to 8 GByte low-voltage DDR3 RAM onboard, the new conga-QA5 supports 4k on up to three displays which can be controlled via dual channel LVDS, eDP, DP 1.2 and/or HDMI 1.4. For IoT connectivity and generic extensions, there are 1x Gigabit Ethernet interface, 4 PCIe lanes and 6 USB ports, one of which is provided as USB 3.0. Additional peripherals can be connected via 1x SPI and 1x serial interface. Two MIPI CSI camera inputs are further provided. For the integration of storage media, up to 64 GB of flash memory with fast eMMC 5.5, or 2x 6 Gbps SATA and 1x SDIO are on offer. Audio signals are carried via HDA.
Supporting up to 8 GByte low-voltage SODIMM memory, the new conga-TCA5 also supports 4k on up to three displays which can be controlled via dual channel LVDS, eDP, DP 1.2 and/or HDMI 1.4. For IoT connectivity and generic extensions, there are 1x Gigabit Ethernet interface, 4 PCIe 2.0 lanes and 6 USB ports, three of which are provided as USB 3.0 and one is a host and client capable USB OTG interface. Additional peripherals can be connected via 2x SPI, 1x LPC and 2x serial UART interfaces. Two MIPI CSI camera inputs are further provided. For the integration of storage media, up to 64 GB of flash memory with fast eMMC 5.1, or 2x 6 Gbps SATA and 1x SDIO are an option. Audio signals are carried via HDA. An optional TPM 2.0 rounds of the feature set of the COM Express Compact Module.
For all modules, software support is provided for Microsoft Windows 10, including the Microsoft Windows 10 IoT versions and all current Linux operating systems. The Board Support Packages will also include support for the latest Wind River IDP 3.1.