congatec boosts module-based high-end embedded computing
congatec extends its COM Express Basic portfolio with the new high-performance conga-TS175 Computer-on-Module. Equipped with the high-end dual chip versions of the brand new Intel Xeon and Gen 7 Intel Core processors (codename Kaby Lake), it sets a new benchmark for module-based high-end embedded computers and modular industrial workstations that need to process massive workloads.
The conga-TS175 COM Express Basic module is available with two quadcore Intel Xeon processors with hyper threading as well as 5 different Intel Core i7, i5 and i3 processors within a 45 to 25 W TDP envelope. Bandwidth intensive applications will benefit from up to 32 gigabytes of fast dual channel 2400 DDR4 memory – including ECC support option. In regards to visual experience, they feature the new Intel HD630 graphics supporting up to three independent displays with up to 4k @ 60 Hz via DisplayPort 1.4 and HDMI 2.0 – both with HDCP 2.2, and eDP 1.4 support. Additionally, the modules also offer dual channel LVDS and VGA for legacy displays. Thanks to hardware-accelerated 10-bit encoding/decoding and high dynamic range of HEVC and VP9, HD streams are becoming more vivid and lifelike in both directions.
The modules offer all the common I/O interfaces of the Type 6 pinout. Powerful system extensions including Intel Optane memory can be connected via PCI Express Gen 3.0 Lanes. 4x SATA 6G ports with RAID0/1 support are available for conventional storage media. Further I/O interfaces include 1x Gigabit Ethernet with Intel AMT support, 4x USB 3.0, 8x USB 2.0, HDA, 4x GPIOs, LPC, SPI, I2C Bus, and 2x UART. The modules support the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT as well as all common Linux operating systems. Individual integration support, an extensive range of accessories as well as optional Embedded Design & Manufacturing Services for individual carrier board and system designs complete the package.