Concurrent: new 3U VPX board for rugged server applications

Concurrent Technologies announces a 3U VPX computing board with significantly improved capabilities for server grade applications within the defense, transportation and industrial markets. TR G4x/msd boasts an Intel Xeon processor with up to 64Gbytes of soldered Error Correcting Code DDR4 memory.  This doubles the current benchmark of 32Gbytes, established by Concurrent Technologies’ existing TR C4x/msd board, within the same Size, Weight and Power envelope.  Rear connectivity includes dual Gigabit Ethernet for control, dual 10-Gigabit Ethernet for data and a x16 PCI Express pipe for direct connection to GPU and FPGA accelerators.  This mirrors the architecture found in high performance server solutions, but in a package suitable for deployment in long life-cycle, challenging environments.

Direct attached storage can be a critical influence on server application performance. The default boot device on TR G4x/msd is a 64 or 128Gbytes Solid State Drive module that is designed for use in hostile environments.  Additional on-board mass storage options include a 2.5-inch SSD or up to two M.2 module adapters.  The 2.5-inch SSD connects to the front panel I/O module and is a solution for high capacity, air-cooled deployments.  For air and rugged conduction-cooled environments, the M.2 adapters fit directly to the base board via higher speed PCI Express connections and utilize the NVMe protocol which is designed to work best with solid state drives.  Various RAID modes are supported when using a pair of M.2 modules, offering application performance and reliability options.  

The Intel Xeon processor D-1500 family used on TR G4x/msd is available with up to 16-cores, enabling board variants to be optimized for high compute performance or lower power consumption.  Concurrent Technologies’ default variant uses the 12-core D-1559 processor matched with 64Gbytes of memory for extended operating temperature applications. Shipments of the air-cooled variants commence imminently with rugged conduction-cooled boards expected later in 2017 once all the additional environmental tests have been completed.

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