ATP reveals 3D NAND SSD product line

ATP Electronics reveals its new 3D NAND based SATA product line up on the Embedded World 2017. The products have gone through stringent chip as well as module level validation tests and will be manufactured using ATP’s in-house self-packaging technology. Available form factors include 2.5”, mSATA, SlimSATA and M.2 in various capacities, including intermediate densities such as 192GB, 384GB and 768GB.

By stacking more layers vertically, greater capacities, such as 1TB, 1.5TB and 2TB, are made possible through 3D NAND. Compared to planar NAND, 3D NAND shows greater cost advantage as the capacity increases. ATP’s high end manufacturing facility is capable of processing NAND wafer dies into ATP’s own SDP, DDP, QDP or ODP BGA packages. This significantly simplifies supply chain planning and results in higher flexibility and better lead times as well as better longevity for products through extended wafer supply agreements with manufacturers.

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ATP increases presence in Europe
ATP reveals 3D NAND SSD product line

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