congatec: COM Express modules with Kaby Lake processors
congatec has released new COM Express Compact modules in time with the launch of the 7th generation of Intel Core SoC processors. The new COM Express computer modules support Intel Optane memory which is based on 3D XPoint technology. Compared to NAND SSDs, it offers significantly lower latency yet is capable of handling the same size of data packets. With a latency of just 10 µs – about a thousand times lower than that of standard HDDs – the boundaries between main memory and storage are becoming fluent.
The new conga-TC175 COM Express Compact modules are equipped with 15 Watt dual-core variants of Gen 7 Intel Core SoC processors. Specifically, these are the 2.8 GHz Intel Core i7 7600U, the 2.6 GHz Intel Core i5 7300U and the 2.4 GHz Intel Core i3 7100U processors as well as the Intel Celeron 3695U processor with 2.2 GHz. The TDP of all variants is configurable from 7.5 to15 Watts, which makes it easier to adapt the application to the energy concept of the system. All modules support up to 32 GB dual channel memory which for DDR4 provides significantly more bandwidth and better energy efficiency than current conventional DDR3L implementations. The Intel® Gen 9 HD Graphics 620 offers high graphics performance with latest DirectX 12 capabilities and supports up to three independent displays with up to 4k @ 60 Hz via eDP 1.4, DisplayPort 1.2 and HDMI 2.0a. Thanks to hardware-accelerated 10-bit encoding/decoding and high dynamic range of HEVC and VP9, HD streams are becoming more vivid and lifelike in both directions. The new computer modules from congatec support the COM Express Type 6 pinout with PCI Express Gen 3.0, USB 3.0 and 2.0, SATA Gen 3, Gigabit Ethernet, and low-speed interfaces such as LPC, I²C and UART. Customized integration support, a comprehensive range of accessories and optional Embedded Design & Manufacturing services for application specific carrier board and system designs are also available.