MACOM enabling rapid transition to 400G for cloud data centers with L-PIC chipset
MACOM Technology Solutions announced the production ready MAOP-L284CN, MACOM’s 100G CWDM4 transmitter L-PICTM (Lasers integrated with a Silicon Photonic Integrated Circuit) and supporting driver and controller IC chipset. To meet the bandwidth demands, resiliency and data redundancy requirements of today’s Cloud Data Centers, data center optical interconnects are transitioning from 100G to 400G, driving explosive demand for high-speed optical links.
MACOM’s demonstration shows the platform’s PAM-4 CWDM4 capability of uncooled operation at 400G at distances up to two kilometers on single mode fiber. These devices leverage key MACOM technologies optimized for high port density applications in Cloud Data Center applications. The demonstration will transmit 100G PAM-4 over a single lambda with the L-PIC platform at OFC 2017.
MACOM’s L-PIC device combines four high-performance distributed feedback (DFB) laser diodes using MACOM’s patented Etched Facet Technology (EFT), four 28G Mach-Zehnder optical modulators integrated with a coarse wavelength division multiplexer, monitor photodiodes and a high-performance output coupler for operation on one standard single mode fiber. Using MACOM’s patented self-aligning etched facet technology (SAEFTTM) for precision attachment of the lasers to the SiPh L-PIC, this device enables customers to bypass optimizing optical coupling with active alignment and curing, offering instead an integrated single device that reduces manufacturer assembly time and component cost.
The MAOP-L284CN L-PIC transmitter is available as part of a complete MACOM chipset platform, including the MAMF-011095 silicon PIC controller and the MASC-37053A high-speed, low-power modulator driver. Optimized to work together, this chipset solution offers customers improved performance, eliminates the need for assembly of discrete components, reduces configuration and test costs, and accelerates time to market. With the recent acquisition of AppliedMicro and their PAM-4 technology, MACOM is extending the L-PIC transmitter platform to support 200G and 400G switch-to-fiber applications.