Toshiba: 3D Flash Memory with TSV technology with high speed data input and output

Toshiba announced development of the BiCS FLASH three-dimensional flash memory utilizing Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Devices fabricated with TSV technology have vertical electrodes and vias that pass through silicon dies to provide connections, an architecture that realizes high speed data input and output while reducing power consumption. Real-world performance has been proven previously, with the introduction of Toshiba’s 2D NAND Flash memory.

Combining a 48-layer 3D flash process and TSV technology has allowed Toshiba to successfully increase product programming bandwidth while achieving low power consumption. The power efficiency of a single package is approximately twice that of the same generation BiCS FLASH memory fabricated with wire-bonding technology. TSV BiCS FLASH also enables a 1-terabyte device with a 16-die stacked architecture in a single package.

Toshiba Memory Corporation will commercialize BiCS FLASH with TSV technology to provide an ideal solution in respect for storage applications requiring low latency, high bandwidth and high IOPS/Watt, including high-end enterprise SSDs.


ZES Zimmer on testing advanced power electronics

In this video Bernd Neuner from ZES Zimmer talks to Alix Paultre for Electronic News TV at the 2017 Power Electronics Conference in Nuremberg. The discussion deals with the issues involving test and m...


Weidmüller discusses the need for a better signal and power interface

In this video Rene Arntzen from Weidmüller talks to Alix Paultre of Electronic News TV about the importance of a good signal and power interface for industrial equipment. There is currently no good ...


Mouser talks about the state of engineering development today

In this video Mark Burr-Lonnon and Graham Maggs of Mouser Electronics, a major international electronics distributor, talk to Alix Paultre about the state of engineering development today. With massiv...


Infineon launches a new family of configurable industrial drive boards

In this video Infineon explains their new family of configurable industrial drive boards at SPS-IPC Drives 2017. Intended to enable easy setup and deployment, the XMC-based automation boards can handl...


STMicro explains their STSPIN family of single-chip motor drivers

In this video STMicroelectronics explains their STSPIN single-chip motor drivers at SPS-IPC Drives 2017. The STSPIN family embeds can drive motors efficiently and with high accuracy, with an advanced ...