TQ: rugged embedded module with latest Intel Apollo Lake processor

The new COM Express TQMxE39C1 compact module from the embedded specialist TQ is available with the latest generation of Intel Atom processors, and it offers attractive technical properties optimized for harsh and rugged applications. The combination of the soldered 4/8GB Dual Channel DDR3L storage, ECC, an extended temperature range specification, optimized cooling solutions and optional conformal coating open up new potential applications for the module in extreme environmental conditions.

The carrier board offers broad capabilities for expansions and auxiliary functions, because of the processor’s maximum utilization of interfaces, such as eight USB ports – including two USB 3.0 ports – as well as up to 4 PCIe lanes. Equipped with the latest Intel graphic processor core, the module offers 4K screen resolution for three different screen contents, 3D video processing and significantly enhanced video encoding/decoding performance. Excellent flexibility is offered by the optional eMMC flash memory and installed component options for either an embedded display port or LVDS and TPM.

Time Coordinated Computing, virtualization and many new functions give customers ideal conditions for real-time applications and time-synchronous IoT solutions. The integrated on-board controller supports thermal management, a multi-stage watchdog and ‘Green ECO-Off’ mode for minimal standby consumption. It also gives customers configuration options (flexiCFG) for a high degree of flexibility. This makes the TQMxE39C1 the optimal computational module for high-end applications in extreme environmental conditions.

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