Portwell: COM Express 3.0 type 7 basic module with four 10GbE interfaces

Portwell announces the release of the PCOM-B701, a COM Express 3.0 Type 7 Basic Module based on the Intel Atom processor C3000 product family. The PCOM-B701 is designed according to the new COM Express Type 7 standard which is a new specification with backward compatibility to the existing Type 6 pinout. While the focus of Type 6 is on display-oriented applications with support for audio and video interfaces, the Type 7 pinout definition is designed for applications that do not require graphics support. Specifically, the COM Express 3.0 specification's Type 7 pinout, when compared to the Type 6 pinout, trades all the graphics interfaces for up to four 10GbE ports, and a total of 32 PCIe lanes. This makes it ideal for applications in micro server and the like that require low power consumption while supporting high computing performance and communication throughput.

Portwell has designed this new PCOM-B701 COM Express Type 7 module to optimize value models and service levels by running network applications securely and reliably on virtualization-optimized platforms. This latest addition extends Portwell’s product family of datacenter COM Express based platforms to enable solutions with even lower power consumption and higher physical density. Back in 2015, Portwell introduced PCOM-B634VG, a Type 6 COM Express module featuring Intel Xeon processor D-1500 series, 10GbE support and integrated VGA, while earlier this year in 2017, adopting also the Intel Xeon processor D-1500 product family, Portwell launched its first Type 7 COM Express module, PCOM-B700G, featuring dual 10GbE-KR ports and up to 28 PCIe lanes.

Portwell then extended the success of PCOM-B634VG and PCOM-B700G to design and develop the PCOM-B701, with the Intel Atom processor C3000 series, Intel’s leadership 64-bit datacenter SoC targeting lower power and high-density design points, to fully meet the COM Express Type 7 standard by enabling the 10GbE-KR interface to four ports. These four 10GbE-KR ports on PCOM-B701 allow customers to flexibly design their physical interface on a carrier board in several modes, KR for backplane connectivity, copper (RJ45), or fiber (SFP+). Additionally, the NC-SI signals provide a way of connecting BMC (baseboard management controller) on the carrier board to achieve remote control and management. Furthermore, there’s an optional onboard eMMC 5.0 interface that offloads the main CPU, and provides a cost-optimized storage solution alternative and lower total power consumption.

Portwell’s clients know they can always count on us to provide them with quality products and longevity support with up to date know-how. Designed with an extensive feature set, the Portwell PCOM-B701 COM Express Type 7 module is developed on a basic 125mm x 95mm footprint with three DDR4 SO-DIMM slots, up to 48GB dual-channel DDR4 at 1866/2133/2400MHz ECC (selected SoC SKUs), up to 12x PCIe 2.0 x1, 1x PCIe 3.0 x8, 2x SATA 6Gb/s, 1x eMMC 5.0 (optional), and 4x USB 3.0/2.0. Moreover, it is also offered with an option for wide operating temperature support with the range of -40 to +85°C (selected SoC SKUs). All in all, the Portwell PCOM-B701 module practically implements the Intel Atom processor C3000 product family’s distinguished features to facilitate broader applications into entry industrial, military/aerospace, energy, robotics and IoT that requires very low power, high density and high I/O integration.

As the markets evolve, Portwell’s versatile COM Express modules adapt to the changes by enabling designers to partition commodity host-processors from proprietary carrier boards, thereby minimizing current and future design risks during the initial phase of development. This design of separating the CPU-upgradable module from system specific I/O carrier boards further safeguards development investments and lowers total cost of ownership. With Portwell’s ready Type 7 evaluation carrier, PCOM-C700, customers can easily start to evaluate and design. In addition, Portwell can also provide services to clients on the carrier board design and development, review schematics and BIOS customization.

More Information...

Latest News from Portwell

Portwell launches three more members to Kuber series
Portwell launches compact and robust IoT gateway PC
Portwell: 19” system targets video wall applications
Portwell: Posiflex to feature integrated IoT Remote Management System
Portwell: Intel Core I embedded board in NUC footprint
Portwell: Mini-ITX powered by Intel Core i family with up to six core performance
Portwell: rugged, fanless, long lifespan embedded system featuring Intel Atom
Portwell: robust box PC meets extended EMI and EMS requirements of demanding applications
Portwell: 10.1-inch IEC 60601-1 compliant touchscreen PC designed for medical equipment
Portwell: KUBE-3100 box-PC meets requirements of demanding applications
Portwell: KUBE-5500 Box-PC for harsh conditions in industrial applications
Portwell: medical grade 10.1 Inch panel PC designed for HMI and hospital bedside terminal
Portwell: Type 7 COM Express evaluation carrier board speeds up time-to-market
Portwell: extremely flexible industrial monitors in 12 variants
Portwell supports UIC standard
Portwell: 4x4-inch Mini PC board for digital signage, automation and medical
Portwell: compact embedded system ideal for kiosk, digital signage, factory automation
Portwell: palm-sized PICO-6260 offers low power and fan-less design
MEDWEL: embedded fanless system with E3900 processors for medical applications
Portwell: compact fan-less embedded system supports wide industrial temperature range

nVent Schroff at Embedded World 2019

The theme of the nVent Schroff booth at Embedded World 2019 was “Experience Expertise – Modularity, Performance, Protection and Design”. Join us as our experts give an overview of th...


Garz & Fricke Interview at Embedded World 2019 with Dr. Arne Dethlefs: We are strengthening our presence in North America

Through its US subsidiary, located in Minnesota, Garz & Fricke is providing support for its growing HMI and Panel-PC business in the USA and Canada while also strengthening its presence in North A...


SECO's innovations at embedded world 2019

In a much larger stand than in previous years, at embedded world 2019 SECO showcases its wide range of solutions and services for the industrial domain and IoT. Among the main innovations, in this vid...


Design and Manufacturing Services at Portwell

Since about two years Portwell is part of the Posiflex Group. Together with KIOSK, the US market leader in KIOSK systems, the Posiflex Group is a strong player in the Retail, KIOSK and Embedded market...


Arrow capabilities in design support

Florian Freund, Engineering Director DACH at Arrow Electronics talks us through Arrow’s transformation from distributor to Technology Platform Provider and how Arrow is positioned in both, Custo...


Arm launches PSA Certified to improve trust in IoT security

Arm’s Platform Security Architecture (PSA) has taken a step forward with the launch of PSA Certified, a scheme where independent labs will verify that IoT devices have the right level of securit...


DIN-Rail Embedded Computers from MEN Mikro

The DIN-Rail system from MEN is a selection of individual pre-fabricated modules that can variably combine features as required for a range of embedded Rail Onboard and Rail Wayside applications. The ...


Embedded Graphics Accelerates AI at the Edge

The adoption of graphics in embedded and AI applications are growing exponentially. While graphics are widely available in the market, product lifecycle, custom change and harsh operating environments...


ADLINK Optimizes Edge AI with Heterogeneous Computing Platforms

With increasing complexity of applications, no single type of computing core can fulfill all application requirements. To optimize AI performance at the edge, an optimized solution will often employ a...


Synchronized Debugging of Multi-Target Systems

The UDE Multi-Target Debug Solution from PLS provides synchronous debugging of AURIX multi-chip systems. A special adapter handles the communication between two MCUs and the UAD3+ access device and pr...


Smart Panel Fulfills Application Needs with Flexibility

To meet all requirement of vertical applications, ADLINK’s Smart Panel is engineered for flexible configuration and expansion to reduce R&D time and effort and accelerate time to market. The...


Artificial Intelligence

Morten Kreiberg-Block, Director of Supplier & Technology Marketing EMEA at Arrow Electronics talks about the power of AI and enabling platforms. Morten shares some examples of traditional designin...


Arrow’s IoT Technology Platform – Sensor to Sunset

Andrew Bickley, Director IoT EMEA at Arrow Electronics talks about challenges in the IoT world and how Arrow is facing those through the Sensor to Sunset approach. Over the lifecycle of the connected ...


AAEON – Spreading Intelligence in the connected World

AAEON is moving from creating the simple hardware to creating the great solutions within Artificial Intelligence and IoT. AAEON is offering the new solutions for emerging markets, like robotics, drone...


Arrow as a Technology Provider drive Solutions selling approach

Amir Sherman, Director of Engineering Solutions & Embedded Technology at Arrow Electronics talks about the transition started couple of years ago from a components’ distributor to Technology...


Riding the Technology wave

David Spragg, VP, Engineering – EMEA at Arrow Electronics talks about improvements in software and hardware enabling to utilize the AI capabilities. David shares how Arrow with its solutions is ...


ASIC Design Services explains their Core Deep Learning framework for FPGA design

In this video Robert Green from ASIC Design Services describes their Core Deep Learning (CDL) framework for FPGA design at electronica 2018 in Munich, Germany. CDL technology accelerates Convolutional...


Microchip explains some of their latest smart home and facility solutions

In this video Caesar from Microchip talks about the company's latest smart home solutions at electronica 2018 in Munich, Germany. One demonstrator shown highlights the convenience and functionalit...


Infineon explains their latest CoolGaN devices at electronica 2018

In this video Infineon talks about their new CoolGaN 600 V e-mode HEMTs and GaN EiceDRIVER ICs, offering a higher power density enabling smaller and lighter designs, lower overall system cost. The nor...


Analog Devices demonstrates a novel high-efficiency charge pump with hybrid tech

In this video Frederik Dostal from Analog Devices explains a very high-efficiency charge-pump demonstration at their boot at electronica 2018 in Munich, Germany. Able to achieve an operating efficienc...


wholesale jerseys