ADLINK: hands-on demonstration of OpenRack, OpenSled infrastructure at Broadband World Forum

The telecom industry will get its first view of the Open Compute Project (OCP) carrier grade CG-OpenRack-19 specification featuring ADLINK’s OCP-ACCEPTED OpenSled configuration using the latest Intel Xeon Scalable Processors with Intel C620 Series Chipsets. The CG-OpenRack-19 specification is the result of OCP’s Telecom Working Group, which develops open architecture for carrier grade, frame-level solutions. The open architecture for CG-OpenRack-19 based on the Radisys contributed OCP-ACCEPTED OpenRack specification and ADLINK’s OCP-ACCEPTED OpenSled specification will be on display in the OCP Experience Zone at the international Broadband World Forum.

The OCP-ACCEPTED OpenRack, OpenSled configuration marks a significant milestone in the evolution of OCP CG-OpenRack-19 as it continues the expansion of OCP-CG open architectures. The specification offers telecom data center operators the benefits of open platform standards combined with the needed carrier-grade and environmental enhancements required for Edge Computing in telecom data center environments. The open system approach drives innovation in the market and allows operators to avoid vendor lock-in that comes with propriety solutions.

ADLINK and Radisys are active members in OCP and have been instrumental in defining a technology path to an open architecture solution for the telecom industry. Radisys laid the foundation for the OCP-ACCEPTED CG-OpenRack-19 spec by submitting definitions for the frame, power, interconnect and sled dimensions. Its DCEngine is the industry’s first open hardware solution based on the specification.

The OCP-ACCEPTED OpenSled spec, based on ADLINK’s OCCERA (Open Compute Carrier-grade Edge Reference Architecture), enhances the original spec by providing definitions for the internal configuration options of the CG-OpenRack-19 sled, including options for key appliances to utilize additional components inside the sled.

The ADLINK sled displayed with the OCP CG-OpenRack-19 implementation at the Broadband World Forum will feature the latest Intel Xeon Scalable Processors with Intel C620 Series Chipsets. The platform provides compelling benefits across a broad variety of use models, including big data, artificial intelligence, high-performance computing, enterprise-class IT, cloud, storage, communication and Internet of Things. Feature enhancements over previous versions of Intel Xeon Processor-based platforms include 1.5x memory bandwidth, integrated network/fabric and optional integrated accelerators.

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