Winbond: TrustME secure flash memory supports TCG DICE architecture
Winbond Electronics announced an expansion of its TrustME Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture specification. As the industry’s first Common Criteria EAL5+ certified Secure Flash, and now with the addition of support for the TCG DICE, the TrustME W75F Secure Flash provides designers with secure memory solution for Internet of Things, mobile, artificial intelligence, and other demanding applications that call for a secure root of trust, privacy, authentication, code and data confidentiality.
The proliferation of Internet-connected clients in consumer and industrial applications increases privacy and security challenges, which can limit the growth of IoT deployments. While the innovation and application of connected things will continue, establishing root of trust and data confidentiality are some of the biggest concerns designers need to consider when developing new connected devices.
TCG DICE Architectures defines new security and privacy technologies applicable to systems and components. The goal is to provide new approaches to enhancing security and privacy with minimal silicon requirements.
Winbond’s expansion of TrustME W75F Secure Flash with the TCG DICE enables secure execute-in-place to ensure inherent root of trust, create mutual authentication with IoT cloud services and store securely various keys, credentials and certificates. The EAL5+ certified W75F Secure Flash provides protection against physical hacking attacks such as rollback, replay, man-in-the-middle, power analysis and eavesdropping. Comparing to conventional flash devices storing encrypted software, the secure XIP functionality of TrustME W75F Secure Flash eliminates the need for software shadowing and decrypting to additional RAM thus achieves higher system level performance.
To meet the growing demand for high-volume embedded solutions, Winbond TrustMET memories are manufactured in Winbond’s wholly owned and secured 12-inch wafer fabrication facility in Taichung, Taiwan. The first product in the family, the W75F32 at 32Mb density, is in production and available for samples.