Toshiba: UFS devices utilizing 64-layer, 3D Flash memory

Toshiba Memory Europe has started sampling Universal Flash Storage devices utilising Toshiba`s 64-layer, BiCS FLASH 3D flash memory. The new UFS devices meet performance demands for applications that require high-speed read/write performance and low power consumption, including mobile devices such as smartphones and tablets, and augmented and virtual reality systems.

The new line-up will be available in four capacities: 32GB, 64GB, 128GB and 256GB. All of the devices integrate flash memory and a controller in a single, JEDEC-standard 11.5 x 13mm package. The controller performs error correction, wear levelling, logical-to-physical address translation and bad-block management, allowing users to simplify system development.

All four devices are compliant with JEDEC UFS Ver2.1, including HS-GEAR3, which has a theoretical interface speed of up to 5.8Gbps per lane (x2 lanes = 11.6Gbps) while also suppressing any increase in power consumption. Sequential read and write performance of the 64GB device are 900MB/s and 180MB/s, while the random read and write performance are around 200% and 185% better, respectively, than those of previous generation devices. Due to its serial interface, UFS supports full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.


ZES Zimmer on testing advanced power electronics

In this video Bernd Neuner from ZES Zimmer talks to Alix Paultre for Electronic News TV at the 2017 Power Electronics Conference in Nuremberg. The discussion deals with the issues involving test and m...


Weidmüller discusses the need for a better signal and power interface

In this video Rene Arntzen from Weidmüller talks to Alix Paultre of Electronic News TV about the importance of a good signal and power interface for industrial equipment. There is currently no good ...


Mouser talks about the state of engineering development today

In this video Mark Burr-Lonnon and Graham Maggs of Mouser Electronics, a major international electronics distributor, talk to Alix Paultre about the state of engineering development today. With massiv...


Infineon launches a new family of configurable industrial drive boards

In this video Infineon explains their new family of configurable industrial drive boards at SPS-IPC Drives 2017. Intended to enable easy setup and deployment, the XMC-based automation boards can handl...


STMicro explains their STSPIN family of single-chip motor drivers

In this video STMicroelectronics explains their STSPIN single-chip motor drivers at SPS-IPC Drives 2017. The STSPIN family embeds can drive motors efficiently and with high accuracy, with an advanced ...


wholesale jerseys