Eurotech: rugged and HPEC-ready COM Express Type 7 module with Xeon D-1500
Eurotech announces a new fanless COM Express module for rugged and HPEC applications. The CPU-162-23 brings the computational performance and RAM capacity of a server to the field: it is based on the Intel Xeon/Pentium D-1500 processors and supports up to 4x DDR4 SO-DIMM modules with or without ECC for a total capacity of 64GB. The board comes with many high-speed interfaces, such as up to x32 PCI Express lanes, 2x 10Gbps and 1x 10/100/1000Mbps Ethernet ports. Other interfaces include 2x SATA 3.0, 4x USB 3.0 and 4x USB 2.0.
With a variety of high performance CPU configurations and a large memory capacity, the CPU-162-23 is designed to deliver supercomputing processing and data center grade networking to the edge in a very compact module that can be embedded in rugged and fanless systems.
Furthermore, the CPU-162-23 is a reliable building block for Industrial and Transportation applications, enabling server class workloads and high-end embedded IoT edge computing, thanks to its extended operating temperature range (-40 to +85°C), Error Correcting Code memory, soldered down CPU and long-life cycle. With this new board, Eurotech expands its COM Express product portfolio, ranging from the CPU-161-18, a Xeon D-1500 Compact Type 6 module, to the CPU-163-15 Mini Type 10 with the Intel E3800 CPU.
The CPU-162-23 is Everyware Software Framework (ESF) ready, a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi edge computing platform for the development of IoT applications. Distributed and supported by Eurotech, ESF adds advanced security, diagnostics, provisioning, remote access and full integration with Everyware Cloud (EC), Eurotech IoT integration platform (separately available).
The CPU-162-23 supports Yocto Linux and CentOS 7. Other operating systems, including Windows 10 Enterprise and RTOS, are available through Eurotech Professional Services, which also include BIOS personalization, carrier board design, system development and production. Deep module customization, such as feature changes are also available.