Renesas: chip-to-cloud IoT connectivity with new Enterprise Cloud Toolbox

Renesas Electronics announced the new Renesas Synergy Enterprise Cloud Toolbox v1.1 -- a software Application Project that together with the Synergy AE-CLOUD1 kit provides a reference design and starting point for users to connect in 10 minutes or less to enterprise clouds such as Microsoft Azure, Amazon Web Services, and Google Cloud Platform. The Enterprise Cloud Toolbox saves embedded developers weeks or even months to create a secure end-to-end Internet of Things application for monitoring and controlling the surrounding environment in home, building, or industrial automation systems.

The Enterprise Cloud Toolbox software, unlike competitive cloud kits, can be cut and paste into real projects, enabling code reuse to accelerate product development. The software includes project files and C source code for the microcontroller based on the Synergy Software Package v1.3.3, and Java/JavaScript source code for the web dashboard. The MCU software executes on the companion AE-CLOUD1 kit, which contains a Synergy S5D9 fast prototyping board, Wi-Fi module, and a SEGGER J-Link Lite debugger/programmer. To start an IoT application, developers simply download the Cloud Toolbox Application Project for use with either of Synergy development environments - e2 studio or IAR Embedded Workbench - to build and modify the embedded MCU and dashboard source code.

The Enterprise Cloud Toolbox allows developers to use the SSP’s integrated Message Queue Telemetry Transport for NetX Duo and NetX Secure Transport Layer Security to connect to their cloud vendor of choice. At no cost, developers can also make this connection using a Renesas-hosted cloud account. The Enterprise Cloud Toolbox makes it easy for users to visualize their sensor data on a password protected, private dashboard streaming live to the cloud from Synergy MCU-based hardware over Ethernet or Wi-Fi connection.

Renesas is demonstrating the new Enterprise Cloud Toolbox v.1.1 and AE-CLOUD1 kit, along with other new Synergy solutions, at embedded world 2018.


E-Mail Newsletters

nlsc240

Our 3 E-Mail Newsletters: EETimes/EDN Europe, Embedded News and Power Electronics News inform about the latest news in technology and products, as well as technical know-how like white papers, webinars, articles, etc.


B & S / ECE Magazine

- latest issue is online now -

June 2018

Content Highlights

Cover Story

The challanges of IoT security and how to harden the edge

Download now


wholesale jerseys