Pixus: OpenVPX development platform features mix of conduction and air-cooled card guides

Pixus Technologies offers OpenVPX platforms with a mix of card guides that allow IEEE 1101.10 air cooled and IEEE 1101.2 conduction cooled boards to be tested in the same enclosure. The Pixus OpenVPX Development Chassis allows the use of Rear Transition Modules (RTMs) and up to 8 backplane slots at a 1” pitch.  The open frame design provides a convenient approach to attach probes and easily access the plug-in boards.  Pixus offers various slot sizes and profiles of 3U and 6U OpenVPX backplanes compliant to the VITA 65 specification.   A modular power supply allows various modules for +3.3V, +5V, +/- 12V, auxiliary voltages, and other options to be assembled for the ideal power output for each configuration.

Pixus has developed specialty card guides, threaded inserts, and front/filler panels for the 1/2 HP offset spacing of the architecture.  This allows a precision fit and perfect alignment.  The company has also developed an ultra-rugged rail to handle the high insertion forces of 6U OpenVPX designs.  The rail prevents bowing or cracking.

Pixus offers OpenVPX chassis in 19” rackmount, development/desktop, Air Transport Rack (ATR), and ruggedized versions.  The company also provides components, chassis platforms, and modular instrumentation cases in various form factors.


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