congatec: COM Express Computer-on-Modules with 8th gen Intel Xeon and Intel Core processors

congatec introduces its brand-new conga-TS370 COM Express Type 6 Computer-on-Modules in parallel with the launch of the 8th Generation Embedded Intel Xeon and Intel Core processors (codename Coffee Lake H). They propel the 35-45 W TDP class of COM Express Type 6 modules to a new ‘six-pack’ level of high-end embedded computing, offering for the first time up to 6 cores, 12 threads and an impressive turbo boost of up to 4.4 GHz and drive up to three independent 4k UHD displays. Initial tests from congatec indicate that these brand new six-core modules offer between 45 to 50 percent more multi-thread and 15 to 25 percent more single-thread performance, compared to 7th Gen Intel Core processor based variants. At a given TPD, system designs achieve higher bandwidth at overall lower power consumption ultimately leading to higher system efficiency. Target applications are high performance embedded and mobile systems, industrial and medical workstations, storage servers and cloud workstations, as well as media transcoding and edge computing cores.

Beside performance gains, the new congatec modules impress with extended long-term availability of 10 years plus, high bandwidth I/Os with 4x USB 3.1 Gen 2 (10 Gbit/s) and Intel Optane memory support, as well as enhanced security features including Intel Software Guard extensions, Trusted Execution Engine and Intel Platform Trust Technology.

More Information...

Latest News from congatec AG

congatec and Landshut University IoT Innovation Lab cooperate
congatec: first SMARC 2.0 module with NXP i.MX8 processor
congatec teams up with OSADL to optimize support for Real-Time Linux
congatec: COM Express Computer-on-Modules with 8th gen Intel Xeon and Intel Core processors
congatec: MIPI-CSI 2 platform for vision-based ticketing and access control
congatec: SMARC makes digital cockpit designs smarter
congatec: micro server carrier board enables 10GbE edge server designs
congatec introduces MIPI-CSI 2 Smart Camera Kit for rugged vision systems
congatec accelerates real-time hypervisor adoption for the embedded market
congatec: COM Express Type 6 module with AMD Ryzen embedded processors
congatec now listed on APLUS Système Automation’s line card
congatec supports new NXP i.MX8 processors on Qseven and SMARC modules
congatec presents virtualized fog server installation
congatec begins industrial market transition to 10 GbE bandwidth
congatec: quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
congatec announces ComX standardization initiative

E-Mail Newsletters

nlsc240

Our 3 E-Mail Newsletters: EETimes/EDN Europe, Embedded News and Power Electronics News inform about the latest news in technology and products, as well as technical know-how like white papers, webinars, articles, etc.


B & S / ECE Magazine

- latest issue is online now -

June 2018

Content Highlights

Cover Story

The challanges of IoT security and how to harden the edge

Download now


wholesale jerseys