Cadence: analog IC design-for-reliability solution

Cadence Design Systems introduced the Cadence Legato Reliability Solution, the industry’s first software product that meets the challenges of designing high-reliability analog and mixed-signal integrated circuits for automotive, medical, industrial, and aerospace and defense applications. The Legato Reliability Solution provides analog designers with the tools they need to manage their design’s reliabilitythroughout the product lifecycle, from initial test through active life through aging.

Based on the golden, trusted Cadence Spectre Accelerated Parallel Simulator and the Cadence Virtuoso custom IC design platform, the LegatoReliability Solution integrates capabilities into an intuitive cockpit to address the reliability concerns of the three phases of the product lifecycle:

Analog defect analysis accelerates analog defect simulation by upto 100X, reducing test cost and eliminating test escapes, the main source of early failure in IC designs

Electro-thermal analysis avoids premature failures due to therma loverstress during the product’s useful life

Advanced aging analysis enables accurate prediction of product wear-out by analyzing aging acceleration due to temperature and process variation.

More Information...

Latest News from Cadence Design Systems

Cadence selected for machine learning contract to accelerate electronic design innovation
Cadence: library characterization tool employs machine learning and cloud optimizations
Cadence and NI collaborate to simplify next-generation semiconductor and RF development
Cadence: analog IC design-for-reliability solution
Cadence: connect, share, and inspire at CDNLive EMEA 2018 user conference
Cadence: 5th gen Vision Q6 DSP targets smartphone, surveillance, automotive, AR/VR
Cadence: Virtuoso Platform with advanced node support down to 5nm
Cadence: Sigrity PowerDC supports open neutral file format for thermal interoperability
Cadence announces PCI Express 5.0 Verification IP with TripleCheck technology
Cadence: Xcelium logic simulation technology for Arm-based servers
Cadence achieves “Fit for Purpose - TCL1” certification in support of ISO 26262 standard
Cadence: Genus synthesis solution improves multi-functional printer SoCs design development
Cadence: tool suites optimized for Arm Cortex-A75 and Cortex-A55 CPUs and Mali-G72 GPU

E-Mail Newsletters

nlsc240

Our 3 E-Mail Newsletters: EETimes/EDN Europe, Embedded News and Power Electronics News inform about the latest news in technology and products, as well as technical know-how like white papers, webinars, articles, etc.


B & S / ECE Magazine

- latest issue is online now -

June 2018

Content Highlights

Cover Story

The challanges of IoT security and how to harden the edge

Download now


wholesale jerseys