Cadence and NI collaborate to simplify next-generation semiconductor and RF development

Cadence Design Systems and NI announce a broad-ranging collaboration to improve the overall semiconductor development and test process of next-generation wireless, automotive and mobile integrated circuits and modules. To meet customers’ needs for a streamlined and comprehensive solution, Cadence and NI have pursued projects that integrate key design tool technologies into a common user environment toimprove the design, analysis and testing of analog, RF and digital ICs and system-in-package modules spanning from pre-silicon design to volumeproduction test. To further enhance RF development, Cadence has also launched the new Virtuoso RF Solution, which enables RF engineers to design, implement and analyze entire RF modules and RFICs from within the Virtuoso custom IC design platform.

Traditionally, each major stage in the IC development process has operated in isolation supported by a unique and dedicated set of design tools, models, languages and data formats, which can cause design failures due to the manual translation of data between numerous disjointed tools. To address this issue and streamline the RFIC and RF module design flow, Cadence delivered the following capabilities within the new Virtuoso RF solution:

  • RFIC and RF Module co-design: Provides a robust design environment enabling simultaneous editing of multiple ICs on a complex RF module while streamlining design to manufacturing tasks
  • Single “golden” schematic: Offers schematic-driven layout implementation, EM analysis and simulation and physical verification checks of RFIC and RF module design through a single schematic source, reducing design failures
  • Smart electromagnetic simulation interface: Includes an integration between the Cadence Sigrity PowerSI 3D EM Extraction Option and the Virtuoso RF Solution, which automates hours of manualwork required to run critical passive component and interconnect EM simulations so users can run multiple in-design experiments

As part of the collaboration between the two companies, the Cadence interface has been extended to include an integration with the AXIEM 3D planar EM simulator, within the Cadence Virtuoso RF Solution design environment. The AXIEM software’s fast solver technology readily addresses passive structures, transmission lines, large planar antenna and patch array problems with more than 100,000 unknowns, providing the accuracy, capacity and speed engineers need to help them ensure design integrity upon the first attempt. It also incorporates NI’s proprietary full-wave planar Method of Moments (MoM) technology that enables discrete- and fast-frequency sweeps.

The integrated Cadence and NI EM solutions equip engineers with a variety of EM analysis methods for designing RFICs and RF modules. Compatible models are critical to ensuring correlated results across different simulation tools. Cadence and NI are jointly working to deliver common transistor models, ensuring consistent simulation behavior of gallium arsenide (GaAs), gallium nitride (GaN) and silicon transistor models between Microwave Office circuit design software and the Cadence Spectre simulation platform.

The new Virtuoso RF Solution with the integrated AXIEM 3D planar EM solver technology will be sold and supported exclusively by Cadence to leverage years of development and customer deployment expertise.

More Information...

Latest News from Cadence Design Systems

Cadence and NI collaborate to simplify next-generation semiconductor and RF development
Cadence: analog IC design-for-reliability solution
Cadence: connect, share, and inspire at CDNLive EMEA 2018 user conference
Cadence: 5th gen Vision Q6 DSP targets smartphone, surveillance, automotive, AR/VR
Cadence: Virtuoso Platform with advanced node support down to 5nm
Cadence: Sigrity PowerDC supports open neutral file format for thermal interoperability
Cadence announces PCI Express 5.0 Verification IP with TripleCheck technology
Cadence: Xcelium logic simulation technology for Arm-based servers
Cadence achieves “Fit for Purpose - TCL1” certification in support of ISO 26262 standard
Cadence: Genus synthesis solution improves multi-functional printer SoCs design development
Cadence: tool suites optimized for Arm Cortex-A75 and Cortex-A55 CPUs and Mali-G72 GPU

Dirk Giesen describes the Parasoft tool suite for Embedded Software Development

Are you responsible for embedded software development in your organization? Your goal should be to create safe, secure, and reliable software. To make sure your device will work properly, deploy Paras...


Ross Sabolik of Silicon Labs talks about advanced Power over Ethernet

In this video Ross Sabolik of Silicon Labs talks about smart  Power over Ethernet systems with Alix Paultre at their APEC exhibit in San ANtonio, Texas. As PoE migrates to higher power levels and...


Dialog Semi walks through their latest IC solutions for battery chargers

In this video an engineer from Dialog Semiconductor walks us through their latest ICs for battery chargers at APEC 2018. Dialog's Qualcomm Quick Charge adapter solutions offer high efficiency to e...


Steve Allen of pSemi explains their latest LED driver solution

Steve Allen of pSemi explains their latest LED boost product based on Arctic Sand's two-stage architecture. Their PE23300 has a charge-pump, switched-capacitor architecture that offloads most of t...


Teledyne describes their latest 12-bit Wavepro HD oscilloscope

In this video Teledyne LeCroy describes their latest Wavepro HD oscilloscope to Alix Paultre of Power Electronics News at the company's launch event. The WavePro HD high-definition oscilloscope de...


Dialog Semi walks through their latest IC solutions for battery chargers

In this video an engineer from Dialog Semiconductor walks us through their latest ICs for battery chargers at APEC 2018. Dialog's Qualcomm Quick Charge adapter solutions offer high efficiency to e...


ROHM explains their latest wireless battery charger solution kit

In this video an engineer from ROHM goes over their latest wireless power development kit, co-developed with Würth for embedded development. The kit provides a complete wireless power transfer sy...


Tektronix describes their latest mixed-signal oscilloscope

In this video Tektronix explains the features in their latest 5 Series MSO Mixed Signal Oscilloscope. Features include an innovative pinch-swipe-zoom touchscreen user interface, a large high-definitio...


AVX shows a supercapacitor demonstrator at APEC

In this video Eric from AVX explains their supercapacitor demonstrator box at APEC 2018 in San Antonio, Texas. The box shows how a 5V 2.5-farad supercapacitor can quickly charge up using harvested ene...


OnSemi explains their latest passive smart wireless sensor for industrial applications

In this video On Semiconductor explains their latest wireless sensor for hazardous environments at APEC in San Antonio, Texas. Intended for applications like high-voltage power cabinets and other plac...


TI demonstrates an improved gaming power system at Embedded World

In this video Texas Instruments' explains Significant reduction in ripple, which results in improved reliability and increased design margins, among other advantages. Another benefit that improve...


Infineon explains their latest motor drive technology at APEC 2018

In this video Infineon demonstrates new gate drivers using their LS-SOI technology at APEC 2018. In the demo Victorus, an Infineon application engineer, shows in real time how much better thermal the ...


STMicro goes over their latest wireless-enabled microcontroller for the IoT

In this video STMicroelectronics goes over their latest wireless-enabled STM32WB microcontroller for the IoT and intelligent devices in several live connectivity demonstrations at Embedded World 2018....


wholesale jerseys