Arrow: IC solution reduces IO-Link development time and costs

Arrow Electronics has announced a new family of IC devices that enable companies to quickly add IO-Link Master functionality to their products without the addition of royalties or licence fees. Arrow joined the IO-Link Consortium in April.

The first device launched is a fully integrated STM32 microcontroller with an IO-Link Master software stack, IOLM4P-STM32L, which can control up to four IO-Link Devices via various IO-Link transceivers. The all-in-one IO-Link Master 4-port solution, will help to simplify designs, accelerate development schedules, reduce software development efforts and cut down on non-recurring engineering costs.

Arrow created the IOLM4P with TEConcept, a German engineering company that is an accredited IO-Link competence and test centre. TEConcept develops IO-Link protocol stacks for masters and devices as well as tools for conformance tests.

Industry 4.0 and smart factory requirements have resulted in integration of IO-Link (IEC 61131-9) connectivity becoming increasingly important when developing products for the industrial market. Manufacturers designing an IO-Link multiport Master typically implement the interface protocol on a dedicated microcontroller. The protocol stack is usually licensed from a third-party technology provider as the development of a new stack can be expensive and time consuming. Nevertheless, this approach still introduces considerable NRE costs and requires porting the stack to a microcontroller and an IO-Link transceiver.

To help developers reduce time to market, Arrow worked with TEConcept to produce a new family of devices based on STM32L-Series microcontrollers and IO-Link ICs like the L6360 and L6362 from STMicroelectronics. The first offering, IOLM4P-STM32L, includes the proven TEConcept IO-Link Master stack and supports the connection of up to four independent IO-Link Devices at cycle times down to 400 µs. It is controlled via a simple SPI-based command interface by host systems that typically connect to field busses or proprietary backplane busses.

nVent Schroff at Embedded World 2019

The theme of the nVent Schroff booth at Embedded World 2019 was “Experience Expertise – Modularity, Performance, Protection and Design”. Join us as our experts give an overview of th...


Garz & Fricke Interview at Embedded World 2019 with Dr. Arne Dethlefs: We are strengthening our presence in North America

Through its US subsidiary, located in Minnesota, Garz & Fricke is providing support for its growing HMI and Panel-PC business in the USA and Canada while also strengthening its presence in North A...


SECO's innovations at embedded world 2019

In a much larger stand than in previous years, at embedded world 2019 SECO showcases its wide range of solutions and services for the industrial domain and IoT. Among the main innovations, in this vid...


Design and Manufacturing Services at Portwell

Since about two years Portwell is part of the Posiflex Group. Together with KIOSK, the US market leader in KIOSK systems, the Posiflex Group is a strong player in the Retail, KIOSK and Embedded market...


Arrow capabilities in design support

Florian Freund, Engineering Director DACH at Arrow Electronics talks us through Arrow’s transformation from distributor to Technology Platform Provider and how Arrow is positioned in both, Custo...


Arm launches PSA Certified to improve trust in IoT security

Arm’s Platform Security Architecture (PSA) has taken a step forward with the launch of PSA Certified, a scheme where independent labs will verify that IoT devices have the right level of securit...


DIN-Rail Embedded Computers from MEN Mikro

The DIN-Rail system from MEN is a selection of individual pre-fabricated modules that can variably combine features as required for a range of embedded Rail Onboard and Rail Wayside applications. The ...


Embedded Graphics Accelerates AI at the Edge

The adoption of graphics in embedded and AI applications are growing exponentially. While graphics are widely available in the market, product lifecycle, custom change and harsh operating environments...


ADLINK Optimizes Edge AI with Heterogeneous Computing Platforms

With increasing complexity of applications, no single type of computing core can fulfill all application requirements. To optimize AI performance at the edge, an optimized solution will often employ a...


Synchronized Debugging of Multi-Target Systems

The UDE Multi-Target Debug Solution from PLS provides synchronous debugging of AURIX multi-chip systems. A special adapter handles the communication between two MCUs and the UAD3+ access device and pr...


Smart Panel Fulfills Application Needs with Flexibility

To meet all requirement of vertical applications, ADLINK’s Smart Panel is engineered for flexible configuration and expansion to reduce R&D time and effort and accelerate time to market. The...


Artificial Intelligence

Morten Kreiberg-Block, Director of Supplier & Technology Marketing EMEA at Arrow Electronics talks about the power of AI and enabling platforms. Morten shares some examples of traditional designin...


Arrow’s IoT Technology Platform – Sensor to Sunset

Andrew Bickley, Director IoT EMEA at Arrow Electronics talks about challenges in the IoT world and how Arrow is facing those through the Sensor to Sunset approach. Over the lifecycle of the connected ...


AAEON – Spreading Intelligence in the connected World

AAEON is moving from creating the simple hardware to creating the great solutions within Artificial Intelligence and IoT. AAEON is offering the new solutions for emerging markets, like robotics, drone...


Arrow as a Technology Provider drive Solutions selling approach

Amir Sherman, Director of Engineering Solutions & Embedded Technology at Arrow Electronics talks about the transition started couple of years ago from a components’ distributor to Technology...


Riding the Technology wave

David Spragg, VP, Engineering – EMEA at Arrow Electronics talks about improvements in software and hardware enabling to utilize the AI capabilities. David shares how Arrow with its solutions is ...


ASIC Design Services explains their Core Deep Learning framework for FPGA design

In this video Robert Green from ASIC Design Services describes their Core Deep Learning (CDL) framework for FPGA design at electronica 2018 in Munich, Germany. CDL technology accelerates Convolutional...


Microchip explains some of their latest smart home and facility solutions

In this video Caesar from Microchip talks about the company's latest smart home solutions at electronica 2018 in Munich, Germany. One demonstrator shown highlights the convenience and functionalit...


Infineon explains their latest CoolGaN devices at electronica 2018

In this video Infineon talks about their new CoolGaN 600 V e-mode HEMTs and GaN EiceDRIVER ICs, offering a higher power density enabling smaller and lighter designs, lower overall system cost. The nor...


Analog Devices demonstrates a novel high-efficiency charge pump with hybrid tech

In this video Frederik Dostal from Analog Devices explains a very high-efficiency charge-pump demonstration at their boot at electronica 2018 in Munich, Germany. Able to achieve an operating efficienc...


wholesale jerseys