DATA MODUL: ultra slim SBCs expand possible applications

DATA MODUL reacts to the constantly increasing demand for faster, more efficient and, at the same time, well-designed boards with their own ultra slim SBC development, the eDM-SBC-iMX6-PPC. In sensitive sectors such as medicine, these SBCs are used particularly frequently, as they are generally more vibration and shock resistant than module-based systems. With the SBC form factor, especially designed for slim PPCs, DATA MODUL is standardizing ARM boards for the first time, as these allow the slim implementation of particularly popular display formats such as 7'', 10.1'' 12'' and 15.6''. Standard kits, consisting of display, the easyTouch sensor, also developed by DATA MODUL, controller and corresponding cabling, also only require short lead times.

DATA MODUL has specialized in mechanical integration and, to achieve an optimum casing construction, design and function aspects with regard to material, dimensions, production possibilities and feasibility must be analyzed. Speakers, cameras, light conductors, semi-transparent surfaces and specific surface roughness of the front frame are challenges when developing a casing concept. The demanding EMC requirements and the heat management systems are taken into account at all times by the DATA MODUL construction department.

With its 130 x 80mm dimensions, this format offers 30% more room in width and thus allows more leeway for interfaces than Pico-ITX (100mm). To be able to make use of the maximum installation space behind a 7'' LCD, the height was increased to 80 compared to the Pico-ITX of 72 mm. The assembly can reach the extremely low depth of maximum 13 mm by using flat connectors, where the mating connectors are applied at the side. In this way, no installation height is lost through the connection of the interfaces and the network cable bushing (RJ45) remains the highest point of the assembly. To become even flatter, an integrated version was used which finally led to a top level of 8.2 mm from the top edge of the circuit board.

Fitted with the NXPi.MX6 ARM Cortex A9 processor family, scalable from 1 to 4 ARM cores, the (long-term) availability of the CPU is guaranteed until 2028. It has a sophisticated high-end 3D-capable HD graphics interface. Single supply DC was implemented as a power supply. A 12VDC +/-5% or a wide range input with 16VDC to 32VDC can be selected via the equipment option. The 2 x 24 Bit LVDS interface allows the connection of LC displays with a resolution of up to 1920x1200 pixels (WUXGA). The backlight supply with PWM dimming is already available.

A micro HDMI socket was included as an external graphics interface. The assembly is designed for the extended temperature range and can also be delivered painted if required (conformal coating) to avoid short circuits in humid ambient environments. Up to 2 GB of main memory and up to 64GB of eMMC SDD can be soldered and a WIFI/BT module (M.2 standard) can be optionally fitted. Along with the mPCIE interface for the optional extensions with standard modules, 4 x USB 2.0, 1 x Gigabit ethernet, audio with amplifier, SPI, 2 x CAN /UART and 8 GPIOs have been brought out. The micro SD card socket on the bottom side also enables to expand with cheap mass storage devices for data collection.

 

nVent Schroff at Embedded World 2019

The theme of the nVent Schroff booth at Embedded World 2019 was “Experience Expertise – Modularity, Performance, Protection and Design”. Join us as our experts give an overview of th...


Garz & Fricke Interview at Embedded World 2019 with Dr. Arne Dethlefs: We are strengthening our presence in North America

Through its US subsidiary, located in Minnesota, Garz & Fricke is providing support for its growing HMI and Panel-PC business in the USA and Canada while also strengthening its presence in North A...


SECO's innovations at embedded world 2019

In a much larger stand than in previous years, at embedded world 2019 SECO showcases its wide range of solutions and services for the industrial domain and IoT. Among the main innovations, in this vid...


Design and Manufacturing Services at Portwell

Since about two years Portwell is part of the Posiflex Group. Together with KIOSK, the US market leader in KIOSK systems, the Posiflex Group is a strong player in the Retail, KIOSK and Embedded market...


Arrow capabilities in design support

Florian Freund, Engineering Director DACH at Arrow Electronics talks us through Arrow’s transformation from distributor to Technology Platform Provider and how Arrow is positioned in both, Custo...


Arm launches PSA Certified to improve trust in IoT security

Arm’s Platform Security Architecture (PSA) has taken a step forward with the launch of PSA Certified, a scheme where independent labs will verify that IoT devices have the right level of securit...


DIN-Rail Embedded Computers from MEN Mikro

The DIN-Rail system from MEN is a selection of individual pre-fabricated modules that can variably combine features as required for a range of embedded Rail Onboard and Rail Wayside applications. The ...


Embedded Graphics Accelerates AI at the Edge

The adoption of graphics in embedded and AI applications are growing exponentially. While graphics are widely available in the market, product lifecycle, custom change and harsh operating environments...


ADLINK Optimizes Edge AI with Heterogeneous Computing Platforms

With increasing complexity of applications, no single type of computing core can fulfill all application requirements. To optimize AI performance at the edge, an optimized solution will often employ a...


Synchronized Debugging of Multi-Target Systems

The UDE Multi-Target Debug Solution from PLS provides synchronous debugging of AURIX multi-chip systems. A special adapter handles the communication between two MCUs and the UAD3+ access device and pr...


Smart Panel Fulfills Application Needs with Flexibility

To meet all requirement of vertical applications, ADLINK’s Smart Panel is engineered for flexible configuration and expansion to reduce R&D time and effort and accelerate time to market. The...


Artificial Intelligence

Morten Kreiberg-Block, Director of Supplier & Technology Marketing EMEA at Arrow Electronics talks about the power of AI and enabling platforms. Morten shares some examples of traditional designin...


Arrow’s IoT Technology Platform – Sensor to Sunset

Andrew Bickley, Director IoT EMEA at Arrow Electronics talks about challenges in the IoT world and how Arrow is facing those through the Sensor to Sunset approach. Over the lifecycle of the connected ...


AAEON – Spreading Intelligence in the connected World

AAEON is moving from creating the simple hardware to creating the great solutions within Artificial Intelligence and IoT. AAEON is offering the new solutions for emerging markets, like robotics, drone...


Arrow as a Technology Provider drive Solutions selling approach

Amir Sherman, Director of Engineering Solutions & Embedded Technology at Arrow Electronics talks about the transition started couple of years ago from a components’ distributor to Technology...


Riding the Technology wave

David Spragg, VP, Engineering – EMEA at Arrow Electronics talks about improvements in software and hardware enabling to utilize the AI capabilities. David shares how Arrow with its solutions is ...


ASIC Design Services explains their Core Deep Learning framework for FPGA design

In this video Robert Green from ASIC Design Services describes their Core Deep Learning (CDL) framework for FPGA design at electronica 2018 in Munich, Germany. CDL technology accelerates Convolutional...


Microchip explains some of their latest smart home and facility solutions

In this video Caesar from Microchip talks about the company's latest smart home solutions at electronica 2018 in Munich, Germany. One demonstrator shown highlights the convenience and functionalit...


Infineon explains their latest CoolGaN devices at electronica 2018

In this video Infineon talks about their new CoolGaN 600 V e-mode HEMTs and GaN EiceDRIVER ICs, offering a higher power density enabling smaller and lighter designs, lower overall system cost. The nor...


Analog Devices demonstrates a novel high-efficiency charge pump with hybrid tech

In this video Frederik Dostal from Analog Devices explains a very high-efficiency charge-pump demonstration at their boot at electronica 2018 in Munich, Germany. Able to achieve an operating efficienc...


wholesale jerseys