ADLINK: two new CompactPCI 2.0 processor blades with latest Intel Xeon, Core and Atom

ADLINK Technology released two new CompactPCI 2.0 processor blades, the cPCI-3630 and cPCI-6636. The cPCI-3630 is a 3U CompactPCI processor blade featuring the 64-bit Intel Atom Processor X Series SoC and up to 8GB soldered DDR3L-1600 MHz ECC memory. The Intel Atom Processor X Series integrates the low-power 9th generation graphics engine and provides excellent graphics, media and display support. Available in single-slot (4HP) or dual-slot (8HP) width form factors, the cPCI-3630 utilizes various daughter boards to provide a broad range of I/O functionality. One of the dual-slot variants supports an XMC site on layer 2. Storage options include an onboard 32GB SSD, CFast or mSATA socket and 2.5" SATA drive space on the layer 2 riser card.

ADLINK’s cPCI-6636 is a 6U CompactPCI processor blade powered by the 6th/7th generation Intel Xeon E3 and Intel Core i3/i5/i7 Processors with Intel HM170 or CM236 Chipsets. The cPCI-6636 supports up to 32GB DDR4-2133 memory with 16GB soldered onboard and up to 16GB via SODIMM socket. In addition to the significant performance boost enabled by the latest Intel processors, the cPCI-6636 also supports a variety of faceplate I/O interfaces in both single-slot (4HP) and dual-slot (8HP) width form factors. The dual-slot version cPCI-6636DZ supports 6x RS-232 serial ports and 8x USB 3.0 for high speed transmission. Storage options include one 2.5" SATA drive space, one 7-pin SATA connector and one CFast slot by adapter board. An XMC connector via PCIe x8 adapter board is supported in place of the CFast on another dual-slot variant cPCI-6636D.

Featuring ADLINK’s Smart Embedded Management Agent (SEMA) for online system health monitoring, the cPCI-3630 and cPCI-6636 support independent operation in both host and peripheral slots without CompactPCI bus communication (satellite mode). While the EN 50155 compliant cPCI-3630 provides an ideal solution for railway transportation, medical and industrial automation that require optimal computing performance for data transfer with lower power consumption, the cPCI-6636 offers a high-density solution for military, aviation and other mission-critical applications that require robust computing in a rugged and reliable CompactPCI system.

More Information...

Latest News from ADLINK Technology

ADLINK: pole mounted multi-access edge AI and machine learning solution
ADLINK partners with Google Cloud to offer IoT ready solutions
ADLINK to optimize AI with heterogeneous computing at the Edge
ADLINK: DMI touch panel computer for train control and rail signaling
ADLINK: two new CompactPCI 2.0 processor blades with latest Intel Xeon, Core and Atom
ADLINK: “quad” core i3 value processor on COM Express
ADLINK to exhibit at Edge Computing Congress 2018
ADLINK: COTS solutions for train control, rail signaling and automation at InnoTrans 2018
ADLINK honoured Edge Computing Company of the Year
ADLINK joins Open Networking Foundation as collaborating innovator
ADLINK: smart gateway selected for Michelin-SoftBank tire control system
ADLINK partners with FFG for 5G- and ROS2-based factories of the future
ADLINK: fanless Embedded computers with Windows 7 support
ADLINK demonstrates Fog Computing at embedded world
ADLINK brings ‘AI at the Edge’ with NVIDIA technology
ADLINK supports SGeT’s UIC with XRCE middleware for device-fog-cloud computing
ADLINK and MECSware to demonstrate Private LTE at Mobile World Congress
ADLINK at Embedded World 2018
ADLINK: insights on how to transform current factories into factories of the future
ADLINK: IIoT-ready rugged, compact IoT gateway/controller

DIN-Rail Embedded Computers from MEN Mikro

The DIN-Rail system from MEN is a selection of individual pre-fabricated modules that can variably combine features as required for a range of embedded Rail Onboard and Rail Wayside applications. The ...


Embedded Graphics Accelerates AI at the Edge

The adoption of graphics in embedded and AI applications are growing exponentially. While graphics are widely available in the market, product lifecycle, custom change and harsh operating environments...


ADLINK Optimizes Edge AI with Heterogeneous Computing Platforms

With increasing complexity of applications, no single type of computing core can fulfill all application requirements. To optimize AI performance at the edge, an optimized solution will often employ a...


Synchronized Debugging of Multi-Target Systems

The UDE Multi-Target Debug Solution from PLS provides synchronous debugging of AURIX multi-chip systems. A special adapter handles the communication between two MCUs and the UAD3+ access device and pr...


Smart Panel Fulfills Application Needs with Flexibility

To meet all requirement of vertical applications, ADLINK’s Smart Panel is engineered for flexible configuration and expansion to reduce R&D time and effort and accelerate time to market. The...


AAEON – Spreading Intelligence in the connected World

AAEON is moving from creating the simple hardware to creating the great solutions within Artificial Intelligence and IoT. AAEON is offering the new solutions for emerging markets, like robotics, drone...


ASIC Design Services explains their Core Deep Learning framework for FPGA design

In this video Robert Green from ASIC Design Services describes their Core Deep Learning (CDL) framework for FPGA design at electronica 2018 in Munich, Germany. CDL technology accelerates Convolutional...


Microchip explains some of their latest smart home and facility solutions

In this video Caesar from Microchip talks about the company's latest smart home solutions at electronica 2018 in Munich, Germany. One demonstrator shown highlights the convenience and functionalit...


Infineon explains their latest CoolGaN devices at electronica 2018

In this video Infineon talks about their new CoolGaN 600 V e-mode HEMTs and GaN EiceDRIVER ICs, offering a higher power density enabling smaller and lighter designs, lower overall system cost. The nor...


Analog Devices demonstrates a novel high-efficiency charge pump with hybrid tech

In this video Frederik Dostal from Analog Devices explains a very high-efficiency charge-pump demonstration at their boot at electronica 2018 in Munich, Germany. Able to achieve an operating efficienc...


Microchip demonstrates a flexible motion control platform at electronica

In this video Marcus from Microchip explains a motion control demonstration at their booth at electronica 2018 in Munich, Germany. The demonstration underscores the ability of the solution to rapidly ...


Infineon goes over their latest SiC devices for automotive systems

In this video an Infineon engineer goes over their latest Silicon Carbide (SiC) devices for automotive systems at electronica 2018 in Munich, Germany. Among the devices described are an inverter for a...


Bertrand Lombardo of Honeywell, Sensing requirements of IoT

Bertrand Lombardo, Sales director for EMEA for Honeywell SIOT discusses future sensing trends in relation to IoT at Electronica 2019 with Alix Paultre. Links to more information: Dynamic Hone...


Analog Devices updates their Silent Switcher technology

In this video an FAE from Analog Devices explains the latest version of their Silent Switcher technology, which addresses noise issues in power systems. He describes a live demonstration in their boot...


Western Digital talks about their automotive-grade memory solutions

In this video Martin Booth from Western Digital talks about the company's memory solutions specifically designed for automotive applications and the harsh environments involved. Systems such as ne...


Picotest demonstrates their latest advanced power test solutions

In this video Steve Sandler from Picotest shows us two of the company's latest test solutions at electronica 2018 in Munich, Germany. The first demo is of a micro-Ohm-resolution power rail measure...


STMicro describes their latest smart 48V DC brushless motor driver board

In this video an engineer from STMIcroelectronics explains a motor-driver board setup based on their L9907 smart power device at electronics 2018 in Munich, Germany. Based on BCD-6s technology. the de...


Microchip shows their newest PolarFire FPGAs at electronica 2018

In this video Microchip shows a one of the demos highlighting the capabilities of their newest low-power PolarFire FPGAs at electronica 2018 in Munich, Germany. The demonstration shown here is a kit f...


Western Digital discusses their memory solutions for Cloud-enabled devices

In this video Ze'ev Paas of Western Digital talks to Alix Paultre of Aspencore Media about their latest memory products at electronica 2018 in Munich, Germany. Depending on the application space, ...


Picotest explains a couple of power test systems at electronica 2018

In this video Steve Sandler from Picotest explains a couple of his power test systems at electronica 2018 in Munich, Germany. The first demonstration shows a micro-Ohm measurement system, and the seco...


wholesale jerseys