Infineon: connection between the real and digital worlds on show at electronica 2018

Infineon Technologies gives answers to the major questions related to digitization: How can clean energy be produced and how does it get into the electric car quickly and with low losses? What makes servers more efficient as we transfer more and more data to the cloud? How suitable are robots already for use in everyday life? And how do we protect ourselves in a connected world against attackers from cyberspace? Together with customers and strategic partners, Germany's largest semiconductor manufacturer is working on solutions for the connected world of tomorrow. Infineon will showcase the connection between the real and digital worlds at booth 503 in Hall C3 at electronica 2018, from 13 to 16 November.

Emission-free vehicles make sustainable mobility possible. And that is what the ID. BUZZ from Volkswagen stands for: The versatile all-wheel drive vehicle transfers the Microbus feeling into the future. Of course, the zero-emission Microbus is prepared for highly automated driving.To earn its name, emission-free driving needs electricity from renewable sources. For the efficient generation of solar power, Infineon is presenting a solar inverter from SMA Solar that uses CoolSiC technology: the new semiconductor material silicon carbide increases the power density by more than 80 percent. Thus, inverters become more compact and lighter with the same output, or the output increases significantly while size and weight remain unchanged.

For e-mobility to become established, vehicles have to be recharged quickly and efficiently. Infineon will show how charging stations from IONITY enable precisely that: Rapid charging for several hundreds of kilometers and for everyone. The joint venture of BMW, Daimler, Ford and VW was founded in 2017 with the aim of establishing a network of fast charging stations (350 kW) for e-cars along Europe’s main transport routes.

More and more devices, computers and machines produce enormous data flows in the connected world. The same goes for the rising number of sensors that enable innovative artificial intelligence applications. The required servers and data centers are growing in size and becoming increasingly power hungry. Greater efficiency in supplying them with power is possible thanks to alternative semiconductor materials such as gallium nitride – that saves energy and hence CO2 and money. At electronica, Infineon is premiering its CoolGaN product portfolio for use in data transmission (telecom) and servers.

Drones have achieved the breakthrough as a serious mode of transport. Their use to convey loads and people may soon become a part of everyday life. Infineon is presenting a new approach: AURIX™ microcontrollers as flight controllers and CoolGaN solutions for engine control set a new standard in the development of powerful and autonomous carrier drones.

Infineon introduces visitors to its booth to ROBOY. The humanoid robot is remarkably similar to the human body in terms of agility, cognition and sensitivity. Infineon is supporting researchers at the Technical University of Munich who are exploring artificial intelligence in robots as part of the project: ROBOY 2.0 moves smoothly, can recognize people and hold conversations. In the next stage of its development, ROBOY should be able to walk: With the aid of Infineon’s 60-GHz radar sensor XENSIV, it will then be able to recognize the surface below its feet and adapt its movements accordingly thanks to highly sensitive sensors from Infineon.

Infineon’s mission is to make life easier and greener – as well as safer. After all, connected devices that are online can be attacked. Hardware-based security is a central theme that runs through Infineon’s portfolio. With its OPTIGA product family, Infineon delivers robust security tailored to needs for the wide range applications in the Internet of Things, from the smart home to the drone.

That is achieved through the strategic approach “From Product to System”. Members of the Infineon Security Partner Network will present further applications with security chips from Infineon, to protect industrial robots, intellectual property and data, or as electronic door locks for business applications.

nVent Schroff at Embedded World 2019

The theme of the nVent Schroff booth at Embedded World 2019 was “Experience Expertise – Modularity, Performance, Protection and Design”. Join us as our experts give an overview of th...


Garz & Fricke Interview at Embedded World 2019 with Dr. Arne Dethlefs: We are strengthening our presence in North America

Through its US subsidiary, located in Minnesota, Garz & Fricke is providing support for its growing HMI and Panel-PC business in the USA and Canada while also strengthening its presence in North A...


SECO's innovations at embedded world 2019

In a much larger stand than in previous years, at embedded world 2019 SECO showcases its wide range of solutions and services for the industrial domain and IoT. Among the main innovations, in this vid...


Design and Manufacturing Services at Portwell

Since about two years Portwell is part of the Posiflex Group. Together with KIOSK, the US market leader in KIOSK systems, the Posiflex Group is a strong player in the Retail, KIOSK and Embedded market...


Arrow capabilities in design support

Florian Freund, Engineering Director DACH at Arrow Electronics talks us through Arrow’s transformation from distributor to Technology Platform Provider and how Arrow is positioned in both, Custo...


Arm launches PSA Certified to improve trust in IoT security

Arm’s Platform Security Architecture (PSA) has taken a step forward with the launch of PSA Certified, a scheme where independent labs will verify that IoT devices have the right level of securit...


DIN-Rail Embedded Computers from MEN Mikro

The DIN-Rail system from MEN is a selection of individual pre-fabricated modules that can variably combine features as required for a range of embedded Rail Onboard and Rail Wayside applications. The ...


Embedded Graphics Accelerates AI at the Edge

The adoption of graphics in embedded and AI applications are growing exponentially. While graphics are widely available in the market, product lifecycle, custom change and harsh operating environments...


ADLINK Optimizes Edge AI with Heterogeneous Computing Platforms

With increasing complexity of applications, no single type of computing core can fulfill all application requirements. To optimize AI performance at the edge, an optimized solution will often employ a...


Synchronized Debugging of Multi-Target Systems

The UDE Multi-Target Debug Solution from PLS provides synchronous debugging of AURIX multi-chip systems. A special adapter handles the communication between two MCUs and the UAD3+ access device and pr...


Smart Panel Fulfills Application Needs with Flexibility

To meet all requirement of vertical applications, ADLINK’s Smart Panel is engineered for flexible configuration and expansion to reduce R&D time and effort and accelerate time to market. The...


Artificial Intelligence

Morten Kreiberg-Block, Director of Supplier & Technology Marketing EMEA at Arrow Electronics talks about the power of AI and enabling platforms. Morten shares some examples of traditional designin...


Arrow’s IoT Technology Platform – Sensor to Sunset

Andrew Bickley, Director IoT EMEA at Arrow Electronics talks about challenges in the IoT world and how Arrow is facing those through the Sensor to Sunset approach. Over the lifecycle of the connected ...


AAEON – Spreading Intelligence in the connected World

AAEON is moving from creating the simple hardware to creating the great solutions within Artificial Intelligence and IoT. AAEON is offering the new solutions for emerging markets, like robotics, drone...


Arrow as a Technology Provider drive Solutions selling approach

Amir Sherman, Director of Engineering Solutions & Embedded Technology at Arrow Electronics talks about the transition started couple of years ago from a components’ distributor to Technology...


Riding the Technology wave

David Spragg, VP, Engineering – EMEA at Arrow Electronics talks about improvements in software and hardware enabling to utilize the AI capabilities. David shares how Arrow with its solutions is ...


ASIC Design Services explains their Core Deep Learning framework for FPGA design

In this video Robert Green from ASIC Design Services describes their Core Deep Learning (CDL) framework for FPGA design at electronica 2018 in Munich, Germany. CDL technology accelerates Convolutional...


Microchip explains some of their latest smart home and facility solutions

In this video Caesar from Microchip talks about the company's latest smart home solutions at electronica 2018 in Munich, Germany. One demonstrator shown highlights the convenience and functionalit...


Infineon explains their latest CoolGaN devices at electronica 2018

In this video Infineon talks about their new CoolGaN 600 V e-mode HEMTs and GaN EiceDRIVER ICs, offering a higher power density enabling smaller and lighter designs, lower overall system cost. The nor...


Analog Devices demonstrates a novel high-efficiency charge pump with hybrid tech

In this video Frederik Dostal from Analog Devices explains a very high-efficiency charge-pump demonstration at their boot at electronica 2018 in Munich, Germany. Able to achieve an operating efficienc...


wholesale jerseys