Green Hills: INTEGRITY-178 tuMP RTOS conform to FACE Technical Standard v3.0

Green Hills Software has achieved certification of conformance of its INTEGRITY-178 Time-Variant Unified Multi Processing (tuMP) real-time operating system to the Future Airborne Capability Environment (FACE) Technical Standard edition 3.0. The certification covers both the Safety Base profile and the Security profile. The INTEGRITY-178 tuMP RTOS is the first software component of any type to be certified conformant to edition 3.0, which underscores the commitment of Green Hills Software for certification to open standards.

Version 3.0 of the FACE Technical Standard represents a major improvement over the prior version 2.1.1 in that it addresses the use of multicore processors in safety-critical applications.  The technical standard now requires any Operating System Segment (OSS) that claims support for multicore partitions to meet ARINC-653 Part 1 Supplement 4, including the requirement for multicore operation as defined in Section 2: “Multiple processes within a partition scheduled to execute concurrently on different processor cores.” In ARINC-653, each application is called a partition and has its own memory space.

Asymmetric Multi-Processing (AMP), the simplest software architecture in a multicore-based system, is not sufficient to meet the requirements of Supplement 4. INTEGRITY-178 tuMP is the only certified FACE-compliant operating system to meet the requirements of ARINC-653 Supplement 4, and it does so with the availability of Bound Multi-Processing (BMP) in addition to AMP and Symmetric Multi-Processing (SMP). By definition, BMP is an enhanced and restricted form of SMP that can statically bind an application’s ARINC-653 processes (i.e., tasks) to a specific set of cores, allowing the system architect to more tightly control the concurrent operation of multiple cores. INTEGRITY-178 tuMP allows the system developers to bind ARINC-653 processes within an application to a core using an API or using the system configuration file. In addition, INTEGRITY-178 tuMP meets the ARINC-653 Part 2 Supplement 3 requirements for SMP operation.

INTEGRITY-178 tuMP supports all combinations of AMP, SMP, and BMP in a time-partitioned manner (i.e., Time-Variant Unified Multi-Processing) on a multicore processor. Meeting worst-case execution times (WCET) while multiple cores are executing concurrently can be very challenging no matter the choice of AMP, SMP, or BMP. Contention from multiple cores trying to access a given shared resource, such as memory or I/O, can create interference between cores. Certification authorities have emphasized their concerns about such interference by including objectives for interference identification, mitigation, and verification in the CAST-32A position paper. As a true multicore IMA operating system with a proven 8+ year service history, INTEGRITY-178 tuMP includes both a fully capable multicore scheduler and support for bandwidth allocation and management of shared processor resource access. The supported bandwidth management technique emulates a high-rate hardware-based approach to ensure continuous allocation enforcement.

More Information...

Latest News from Green Hills Software

Green Hills: INTEGRITY RTOS deployed in safety remote field controller from Phoenix
Cadence and Green Hills to accelerate embedded system safety and security
Green Hills: INTEGRITY-178 tuMP RTOS conform to FACE Technical Standard v3.0
Green Hills and INTEGRITY Security Services to present and exhibit at embedded world
Arilou and Green Hills collaborate on vehicle network security for automotive OEMs
Green Hills: advanced platforms for next-generation automotive cockpits
Green Hills: secure virtualization for NXP i.MX 8 and 8X applications processors
Green Hills brings Tuxera Flash File System to INTEGRITY RTOS
Green Hills: INTEGRITY-178 tuMP certified as conforming to FACE standard
Green Hills extends trusted instrument cluster solutions to Renesas’ R-Car D3 SoC
Green Hills: Compiler 2018.1 adds C++14 and meets highest levels of functional safety
Green Hills: Secure Platform brings wide range of connected car services
Qt Company and Green Hills: integrated automotive HMI platforms
Renesas and Green Hills collaborate on connected cockpit vehicle
Green Hills expands automotive integrated cockpit coverage to NXP i.MX 8 families
Green Hills: optimising C and C++ compilers for Embedded and IoT processors
Green Hills: INTEGRITY solutions support Xilinx Zynq UltraScale+ MPSoC
Green Hills: INTEGRITY-178 tuMP OS selected for airborne demonstrator
Green Hills: INTEGRITY-178 tuMP selected by flight critical system supplier
Green Hills announces Platform for Secure Connected Car

nVent Schroff at Embedded World 2019

The theme of the nVent Schroff booth at Embedded World 2019 was “Experience Expertise – Modularity, Performance, Protection and Design”. Join us as our experts give an overview of th...


Garz & Fricke Interview at Embedded World 2019 with Dr. Arne Dethlefs: We are strengthening our presence in North America

Through its US subsidiary, located in Minnesota, Garz & Fricke is providing support for its growing HMI and Panel-PC business in the USA and Canada while also strengthening its presence in North A...


SECO's innovations at embedded world 2019

In a much larger stand than in previous years, at embedded world 2019 SECO showcases its wide range of solutions and services for the industrial domain and IoT. Among the main innovations, in this vid...


Design and Manufacturing Services at Portwell

Since about two years Portwell is part of the Posiflex Group. Together with KIOSK, the US market leader in KIOSK systems, the Posiflex Group is a strong player in the Retail, KIOSK and Embedded market...


Arrow capabilities in design support

Florian Freund, Engineering Director DACH at Arrow Electronics talks us through Arrow’s transformation from distributor to Technology Platform Provider and how Arrow is positioned in both, Custo...


Arm launches PSA Certified to improve trust in IoT security

Arm’s Platform Security Architecture (PSA) has taken a step forward with the launch of PSA Certified, a scheme where independent labs will verify that IoT devices have the right level of securit...


DIN-Rail Embedded Computers from MEN Mikro

The DIN-Rail system from MEN is a selection of individual pre-fabricated modules that can variably combine features as required for a range of embedded Rail Onboard and Rail Wayside applications. The ...


Embedded Graphics Accelerates AI at the Edge

The adoption of graphics in embedded and AI applications are growing exponentially. While graphics are widely available in the market, product lifecycle, custom change and harsh operating environments...


ADLINK Optimizes Edge AI with Heterogeneous Computing Platforms

With increasing complexity of applications, no single type of computing core can fulfill all application requirements. To optimize AI performance at the edge, an optimized solution will often employ a...


Synchronized Debugging of Multi-Target Systems

The UDE Multi-Target Debug Solution from PLS provides synchronous debugging of AURIX multi-chip systems. A special adapter handles the communication between two MCUs and the UAD3+ access device and pr...


Smart Panel Fulfills Application Needs with Flexibility

To meet all requirement of vertical applications, ADLINK’s Smart Panel is engineered for flexible configuration and expansion to reduce R&D time and effort and accelerate time to market. The...


Artificial Intelligence

Morten Kreiberg-Block, Director of Supplier & Technology Marketing EMEA at Arrow Electronics talks about the power of AI and enabling platforms. Morten shares some examples of traditional designin...


Arrow’s IoT Technology Platform – Sensor to Sunset

Andrew Bickley, Director IoT EMEA at Arrow Electronics talks about challenges in the IoT world and how Arrow is facing those through the Sensor to Sunset approach. Over the lifecycle of the connected ...


AAEON – Spreading Intelligence in the connected World

AAEON is moving from creating the simple hardware to creating the great solutions within Artificial Intelligence and IoT. AAEON is offering the new solutions for emerging markets, like robotics, drone...


Arrow as a Technology Provider drive Solutions selling approach

Amir Sherman, Director of Engineering Solutions & Embedded Technology at Arrow Electronics talks about the transition started couple of years ago from a components’ distributor to Technology...


Riding the Technology wave

David Spragg, VP, Engineering – EMEA at Arrow Electronics talks about improvements in software and hardware enabling to utilize the AI capabilities. David shares how Arrow with its solutions is ...


ASIC Design Services explains their Core Deep Learning framework for FPGA design

In this video Robert Green from ASIC Design Services describes their Core Deep Learning (CDL) framework for FPGA design at electronica 2018 in Munich, Germany. CDL technology accelerates Convolutional...


Microchip explains some of their latest smart home and facility solutions

In this video Caesar from Microchip talks about the company's latest smart home solutions at electronica 2018 in Munich, Germany. One demonstrator shown highlights the convenience and functionalit...


Infineon explains their latest CoolGaN devices at electronica 2018

In this video Infineon talks about their new CoolGaN 600 V e-mode HEMTs and GaN EiceDRIVER ICs, offering a higher power density enabling smaller and lighter designs, lower overall system cost. The nor...


Analog Devices demonstrates a novel high-efficiency charge pump with hybrid tech

In this video Frederik Dostal from Analog Devices explains a very high-efficiency charge-pump demonstration at their boot at electronica 2018 in Munich, Germany. Able to achieve an operating efficienc...


wholesale jerseys