TDK showcases its product highlights for embedded technologies

TDK shows its latest product innovations for many kinds of embedded technologies at embedded world 2019. Its group companies TDK-Micronas, TDK-Lambda, TDK Europe, and InvenSense present magnetic sensors and embedded motor control solutions as well as power supply solutions and components for Internet-of-Things applications.

The HVC 4420F by TDK-Micronas enables the direct drive of small brush-type, stepper, or brushless electric motors in smart actuators. With flash memory extended to 64 KB and SRAM to 4 KB, the HVC 4420F meets increased functional and diagnostic demands. Currently, OEMs use own ideas and approaches on diagnostics, e.g. for sensor data fusion strategy or actuator status surveillance. To ensure the required data analysis, software routines have to be implemented. Due to its larger memory and the built-in diagnostic feature set, the HVC 4420F offers the storage capacity and processing capability to execute these actions which are unique in the environment of smart actuators. Furthermore, TDK-Micronas will show its extensive portfolio of magnetic field sensor solutions, based on the so-called Hall effect, for Automotive and Industrial applications.

Utilizing DSP technology, TDK-Lambda Genesys+ series of high power density programmable DC power supplies provide improved efficiency, performance and functionality compared to existing products. The Genesys+ series addresses a very broad market, including component, aerospace and automotive testing, semiconductor fabrication, water treatment, plating and solar array simulation. Housed in a 1 U high, 19” (483 mm) wide rack package, the 5 kW model offers the leading power density and, at less than 7.5 kg, lightest weight in the industry.

In addition, TDK-Lambda will present its 600W GXE600 series rated AC-DC power supplies. In a 1U high package, these convection-cooled products have the ability to be digitally programmed across a wide range. The GXE600 series can be operated as a 24 V or 48 V fixed output supply, or programmed to be provide constant voltage, constant current (CVCC) source.

TDK Europe will give an overview of its product range of TDK and EPCOS components for Internet-of-Things applications. This will include RF components, Multilayer and Thin-film inductors, ceramic capacitors, SESUB modules, piezo actuators with haptic feedback and wireless charging coils. One of the highlights is a live demonstration of CeraCharge, the world’s first solid-state SMD rechargeable battery. This new technology combines a relatively high energy density and smallest volume with the safety and high volume manufacturing benefits of ceramic multilayer components. CeraCharge can be used in a wide range of applications – particularly in IoT devices and systems.

InvenSense’s solutions combine MEMS sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. At embedded world, InvenSense will showcase capacitive pressure sensor solutions, analog and digital MEMS microphone solutions, new digital ultrasound transceiver, showcasing 6-DoF controller tracking system, and InvenSense UltraPrint an ultrasound fingerprint touch sensor solution for mobile and IoT products.

nVent Schroff at Embedded World 2019

The theme of the nVent Schroff booth at Embedded World 2019 was “Experience Expertise – Modularity, Performance, Protection and Design”. Join us as our experts give an overview of th...


Garz & Fricke Interview at Embedded World 2019 with Dr. Arne Dethlefs: We are strengthening our presence in North America

Through its US subsidiary, located in Minnesota, Garz & Fricke is providing support for its growing HMI and Panel-PC business in the USA and Canada while also strengthening its presence in North A...


SECO's innovations at embedded world 2019

In a much larger stand than in previous years, at embedded world 2019 SECO showcases its wide range of solutions and services for the industrial domain and IoT. Among the main innovations, in this vid...


Design and Manufacturing Services at Portwell

Since about two years Portwell is part of the Posiflex Group. Together with KIOSK, the US market leader in KIOSK systems, the Posiflex Group is a strong player in the Retail, KIOSK and Embedded market...


Arrow capabilities in design support

Florian Freund, Engineering Director DACH at Arrow Electronics talks us through Arrow’s transformation from distributor to Technology Platform Provider and how Arrow is positioned in both, Custo...


Arm launches PSA Certified to improve trust in IoT security

Arm’s Platform Security Architecture (PSA) has taken a step forward with the launch of PSA Certified, a scheme where independent labs will verify that IoT devices have the right level of securit...


DIN-Rail Embedded Computers from MEN Mikro

The DIN-Rail system from MEN is a selection of individual pre-fabricated modules that can variably combine features as required for a range of embedded Rail Onboard and Rail Wayside applications. The ...


Embedded Graphics Accelerates AI at the Edge

The adoption of graphics in embedded and AI applications are growing exponentially. While graphics are widely available in the market, product lifecycle, custom change and harsh operating environments...


ADLINK Optimizes Edge AI with Heterogeneous Computing Platforms

With increasing complexity of applications, no single type of computing core can fulfill all application requirements. To optimize AI performance at the edge, an optimized solution will often employ a...


Synchronized Debugging of Multi-Target Systems

The UDE Multi-Target Debug Solution from PLS provides synchronous debugging of AURIX multi-chip systems. A special adapter handles the communication between two MCUs and the UAD3+ access device and pr...


Smart Panel Fulfills Application Needs with Flexibility

To meet all requirement of vertical applications, ADLINK’s Smart Panel is engineered for flexible configuration and expansion to reduce R&D time and effort and accelerate time to market. The...


Artificial Intelligence

Morten Kreiberg-Block, Director of Supplier & Technology Marketing EMEA at Arrow Electronics talks about the power of AI and enabling platforms. Morten shares some examples of traditional designin...


Arrow’s IoT Technology Platform – Sensor to Sunset

Andrew Bickley, Director IoT EMEA at Arrow Electronics talks about challenges in the IoT world and how Arrow is facing those through the Sensor to Sunset approach. Over the lifecycle of the connected ...


AAEON – Spreading Intelligence in the connected World

AAEON is moving from creating the simple hardware to creating the great solutions within Artificial Intelligence and IoT. AAEON is offering the new solutions for emerging markets, like robotics, drone...


Arrow as a Technology Provider drive Solutions selling approach

Amir Sherman, Director of Engineering Solutions & Embedded Technology at Arrow Electronics talks about the transition started couple of years ago from a components’ distributor to Technology...


Riding the Technology wave

David Spragg, VP, Engineering – EMEA at Arrow Electronics talks about improvements in software and hardware enabling to utilize the AI capabilities. David shares how Arrow with its solutions is ...


ASIC Design Services explains their Core Deep Learning framework for FPGA design

In this video Robert Green from ASIC Design Services describes their Core Deep Learning (CDL) framework for FPGA design at electronica 2018 in Munich, Germany. CDL technology accelerates Convolutional...


Microchip explains some of their latest smart home and facility solutions

In this video Caesar from Microchip talks about the company's latest smart home solutions at electronica 2018 in Munich, Germany. One demonstrator shown highlights the convenience and functionalit...


Infineon explains their latest CoolGaN devices at electronica 2018

In this video Infineon talks about their new CoolGaN 600 V e-mode HEMTs and GaN EiceDRIVER ICs, offering a higher power density enabling smaller and lighter designs, lower overall system cost. The nor...


Analog Devices demonstrates a novel high-efficiency charge pump with hybrid tech

In this video Frederik Dostal from Analog Devices explains a very high-efficiency charge-pump demonstration at their boot at electronica 2018 in Munich, Germany. Able to achieve an operating efficienc...


wholesale jerseys