ATP prevents DDR3 supply shortage with new own-built DDR3 8 Gbit components and modules
ATP Electronics has announced its commitment to provide its own high-density DDR3 8 Gbit components to ensure the steady supply of DDR3 memory, especially for customers in the networking and embedded industries that are yet unable to upgrade to latest-generation platforms immediately.
As the DRAM market migrates to DDR4 memory, several key manufacturers have already announced end-of-life (EOL) production of DDR3 modules based on high-density DDR3 8 Gbit components, including EOL notice of the components.
ATP’s own-built DDR3 modules consist of meticulously characterized and tested high-quality integrated circuits. The components are manufactured according to ATP’s exacting standards using 2x nm manufacturing process technology and are tested via an extensive component test program to improve the overall memory module performance.
ATP DDR3 8 Gbit components are free from row hammer effects, thus preventing any disastrous random bit flips caused by the electrical charge of cells leaking to adjacent cells and successively writing data to them. At module level, ATP implements 100% test during burn-in (TDBI) into the production flow to guarantee the high-quality module.
ATP DDR3 components are available in monolithic 8 Gb one-chip select (1CS) or as DDP two-chip select (2CS) for a variety of memory modules based on this technology. DIMMs, SO-DIMMs and Mini-DIMMs in 1CS package are available in 16 GB capacity and 1600 MT/s transfer speed. ATP offers 2CS DIMMs in 16 to 32 GB capacity and 1333 or 1600 MT/s, while 2CS Mini-DIMMs are at 8 GB capacity and 1600 MT/s. ECC and non-ECC options are available on various form factors.
ATP is fully committed to supporting the legacy memory requirements of customers that are yet unable to upgrade to newer-generation platforms. In September 2018, ATP signed a partnership agreement with Micron Technology to make sure that Micron DDR2 SO-DIMMs, UDIMMs and RDIMMs will continue to be available after Micron announced end-of-life notices for these modules. According to the agreement, ATP will manufacture DDR2 DRAM modules for customers that continue to use platforms supporting these memory types.