DATA MODUL certified in accordance with ISO 13485

DATA MODUL (DMO) works continually on the expansion of its service portfolio and from now on offers medical technology customers substantial added value in the development and production of profession...

IBASE: COM Express CPU module powered by Kaby Lake

IBASE presents its latest COM Express module supporting the 7th generation of Intel Core SoC processors. The new ET970 is built around the Intel CM238/QM175 chipset that provides a boost in I/O perfor...

acceed: Modbus/TCP module for 3 temperature sensors

Artila is known worldwide as a developer of cost-efficient remote IO modules. Now, the manufacturer has introduced a new device, the RIO-2018 to the market, which is in particular characterised by its...


Connecting Real and Digital World eBook

In cooperation with Infineon the EETimes/EDN Europe team has produced an eBook about Connecting Real and Digital World. The eBook focuses on the topics "Smart Home" and on "5G and Secure Connectivity".

Amongst others, it provides articles about the next level of human machine interaction, how make the smart and connected home secure, hardware-based security for mobile devices, how to overcome the bottleneck your audio chain, securing network equipment is key to supporting IoT infrastructure,


VadaTech expands DAQ Series product range in MTCA.4

VadaTech announces expansion of the DAQ Series product range in MTCA.4. The DAQ523 provides 12 channels of ADC (AD9653) with 2 channels of DAC (MAX5878) coupled to Xilinx Kintex-7 XC7K410T FPGA and no...


Solving the problem of Flash memory density

When product designers are evaluating new ways to meet the demand for miniaturization, system storage is one of their top priorities: serial NOR Flash memory (typically used for storing code) and serial NAND Flash memory (typically used for data storage and as a back-up location for code) occupy a relatively large proportion of the total board real estate in many space-constrained designs. In this article you will learn how improved die-stacking technology reduces pin count, board footprint and system complexity.


SECO: roadmap from NXP i.MX 6 to i.MX 8M

Amongst the most important innovations, SECO introduces an updated version of its Q7-928, a Qseven standard module featuring the NXP i.MX 6 DualPlus applications processor that offers top computationa...

SECO: broad range of Intel based solutions

The increasing complexity of connected machines and the quick development of IoT infrastructures require enhanced processing power and exceptional efficiency, as well as the ability of handling severa...

Atlantik: LTE Cat 1 module supports MIMO technology

Atlantik Elektronik presents the 4G LTE Cat 1 module EG91 from Quectel for wireless M2M communication, which will be a strong support for the IoT. Atlantik Elektronik introduces with the EG91 from Que...

Arrow launches MAX1000 FPGA IoT Maker Board

Arrow Electronics has introduced a new FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into...


Wide Band Gap is no Mystery - Virtual Power Electronics Conference

The areas historically served by silicon devices have in recent years been taken over more often by Wide Band Gap Devices.  In this virtual conference with more than 20 on-demand webinars leading wide band gap companies together with companies from the test & measurement area provide deep insights into designing with GaN and SiC.


congatec: SMARC 2.0 modules support USB-C

congatec introduces new SMARC 2.0 modules supporting powerful USB C connectivity. The utilization of the USB-C specification makes USB interconnects even more universally applicable, further standardi...


ZES Zimmer on testing advanced power electronics

In this video Bernd Neuner from ZES Zimmer talks to Alix Paultre for Electronic News TV at the 2017 Power Electronics Conference in Nuremberg. The discussion deals with the issues involving test and m...


Weidmüller discusses the need for a better signal and power interface

In this video Rene Arntzen from Weidmüller talks to Alix Paultre of Electronic News TV about the importance of a good signal and power interface for industrial equipment. There is currently no good ...


Mouser talks about the state of engineering development today

In this video Mark Burr-Lonnon and Graham Maggs of Mouser Electronics, a major international electronics distributor, talk to Alix Paultre about the state of engineering development today. With massiv...


Infineon launches a new family of configurable industrial drive boards

In this video Infineon explains their new family of configurable industrial drive boards at SPS-IPC Drives 2017. Intended to enable easy setup and deployment, the XMC-based automation boards can handl...


STMicro explains their STSPIN family of single-chip motor drivers

In this video STMicroelectronics explains their STSPIN single-chip motor drivers at SPS-IPC Drives 2017. The STSPIN family embeds can drive motors efficiently and with high accuracy, with an advanced ...


 

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