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Latest Webinars, White Papers & more

The Next Level of Embedded Software Development

This webinar presented by Siemens PLM Software will show how embedded software development can evolve successfully through a unified Application Lifecycle Management (ALM) - to be unlike your development experience before.

Connectivity, Security and the Industrial Internet of Things

Today, a wide range of connected Embedded Systems is available on the market. And the Industrial Internet of Things (IIoT) is driving the addition of more connected devices. But not only “Connectivity” is essential to the success of the IIoT, “Security” is critical too.

Turning Signal Integrity Simulation Inside Out

What does it mean to turn signal integrity simulation inside out? - ANSYS is pursuing a strategy in which electromagnetic simulation is primary and circuit analysis supports the electromagnetic solution, rather than the other way around.

Choosing Inductors for Energy Efficient Power Applications

Designing for highest efficiency performance requires se­lection of inductors with the lowest total loss at application conditions. Calculating total loss can be complicated, but these calculations are built into the Coilcraft power mag­netics tools, making selection, comparison, and analysis as simple as possible.

Thermal Management for Semiconductor Metrology Equipment

Today, automated metrology systems are implemented throughout the thin film semiconductor manufacturing process. In this paper we will review the emerging trend for metrology systems and the implications for their associated thermal management systems.

How to improve SMPS design in terms of performance, usability and costs

This webinar from Infineon will show design engineers how to improve SMPS design in terms of performance, usability and pricing demands. Infineon offers a one-stop-shop service in selecting highly optimized high voltage MOSFETs for various SMPS applications.

3 steps to select the right DBC / AMB substrates for your application

Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) ceramic substrates are the most popular substrates for the assembly and packaging of IGBT and MOSFET bare dies in power modules. As a designer of power modules, you will have to select the right substrate for your application.

Secure Software Licensing for Industry 4.0

The future of the industry is digital and intelligent. At the core of the new infrastructure, we find Cyber Security 4.0 and Digital Business 4.0, both facilitated by CodeMeter Embedded 2.0. The brand new generation of CodeMeter Embedded provides a broad spectrum of new features like an extremely compact footprint, established compatibility with embedded systems and PLCs and wider compatibility with platforms and operating systems.

How Wind River VxWorks RTOS helps to meet the challenges for connectivity, safety, and security

On this Microsite we have put together for you a collection of on-demand Webinars, White Papers, and more which will show how Wind River’s VxWorks can help you to meet the challenges driven by the need for greater connectivity, intelligence, safety, and security.

How Windows 10 IoT and Microsoft Azure can help you to build smart connected devices

Get our collection of White Papers and E-Books from Microsoft about topics like Digital Transformation with IoT,  Building a new Future with Smart Connected Devices, IoT in Manufacturing, Healthcare and Retail…

Simplify Data Analytics for City Fleet Management

Making use of the massive data available from modern fleets can be a challenge. When on-board computers come with built-in cloud smarts, fleet management is much easier.

Using digital isolators in precise analog measurement systems - What designers need to care about

Ground shift is a common problem in industrial applications. It is typically solved with optocouplers or digital isolators. In this webinar, we specifically look at the problems which ground shift causes in precise analog measurement systems.

Model-Based Solutions for  Automotive Systems Engineering

Systems engineering teams need to match the smart features of today’s cars with tools and processes that drive a more reliable, more efficient design process.

Making things come alive in a secure way

With the IoT, multiple applications across multiple industries can share and exchange data across different types of networks. In addition, every single device and sensor is potentially exposed. In other words, with IoT technologies, the surface of attack explodes and must be addressed holistically.

How to ensure the integrity of your embedded systems with Kontron Security Solution

The integrity of embedded systems can be ensured through the use of cryptographic methods in a clearly defined process and a secure hardware device for key management and state storage.  The Kontron Security Solution is a holistic hardware based security solution that provides customers with the ability to address security needs at the application layer.

Reed Relays Handbook - how they work, how they are constructed and how to interpret their specs

This 30-page practical book about reed relays aimed at engineers. It requires little or no theoretical knowledge about the materials they are constructed from, all the issues are dealt with in a practical manner.

Learn how to use Dual PCB Configurable Logic to improve your design

This webinar from Nexperia Logic will show design engineers how and where to use dual PCB configurable logic.which combines two configurable logic devices in a single package with up to 49 different configuration options available in one package.

Embedded Ready for Extremes - how rugged Embedded Computing solutions are built to keep going

Many industries benefit from, if not require, rugged electronics. Military and industrial use is obvious, but professionals in medical, oil and gas, science, transportation, and other industries also need hardware that stands up to punishing situations. Learn more about rugged embedded computing it in this white paper.

Embedded News & Know-how Newsletter

Chips, Boards & Tools -- view the latest issue of our weekly e-mail newsletter with Product News and Technical Know-how for Embedded Designers

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