Category "Small Form Factor Boards & COMs"
Latest Webinars, White Papers & more
Increasing demands on power distribution networks have resulted in smaller DC rails, as well as a proliferation of rails that ensure clean power reaches the pins of integrated circuits. This guide covers five tips for making accurate power integrity measurements with oscilloscopes.
This white paper explains the basic principles of security in a connected world and how a root of trust helps protect the IoT. It describes how embedded developers can secure their IoT devices through solutions available today. Download English Version / Download German Version.
Measuring ripple, noise and transients on today’s low-voltage DC power rails challenges most oscilloscopes. Read this White Paper to learn how to deal with this task.
In this whitepaper, we highlight four main attack scenarios and show how through the use of a hardware trust anchor, we can better address the four use cases: Authentication, Secured Communication, Secured Data Store and integrity and Secured Firmware update.
SMARC is a versatile, small form factor for computer-on-modules. It is suited to applications needing low energy consumption, a low profile, low cost and high performance. This White Paper provides information about: specifications and pinout, carrier board design, heat spreader and height, USB 2.0 and USB 3.0, appllications, etc..
Read in this White Paper how 5G technologies could integrate and enable the full potential of mobile technology, big data, IoT, and cloud computing while supporting digital transformation across various sectors, including healthcare, smart vehicles, smart home, industrial automation, and more.
In this webinar, Mixed Mode and Infineon Technologies showcase effective security concepts and solutions, and demonstrate just how easy it is to protect smart and connected homes using hardware security.
The surface properties of Direct Bonded Copper and Active Metal Brazed substrates are very important for the production of power modules. This webinar will highlight the importance and the influence of copper grain size, surface roughness, surface cleanliness and surface finish on the assembly process.
Panasonic's Bluetooth Low Energy Modules are market leader for power consumption and range. This Webinar will introduce Panasonic's Bluetooth Low Energy Modules, evaluation and development tools and will give you recommendations for your application.
TDK CeraLink™ capacitors are a highly compact solution for the snubber and DC links of fast switching converters, ideal for systems based on SiC and GaN semiconductors.
In this webinar you will learn more about Ready-To-Use RF Antennas, custom integrated antennas for mobile devices and get tips from an expert for the applications markets like IoT, automotive, industrial and medical applications.
Comprehensive device management is a core requirement for any IIoT strategy. The Mentor Embedded IoT Framework provides comprehensive IIoT features that can be implemented down to the hardware of the edge or end node devices – and can be ported across platforms and clouds.
Electromagnetic compatibility is indispensable in today‘s products, and EMC components are the key to ensuring it. This webinar presents individual EMC solutions and shows how support with measurements works – including on-site.
In the field of vehicle diagnosis, the use of Ethernet provides significant improvements in comparison to established methods. But the use of Automotive Ethernet requires rethinking in the development process and validation of such networks.
This White Paper will identify the pros and cons of Single Board Computers and Computer-on-Modules, exploring the technical differences and unique features of both and will also examine the implications of choosing one platform over another from a business perspective.
This White Paper explains how to boot your new Intel IoT design as quickly as possible with minimum fuss. Learn how to take advantage of the boot speed, security, scalability and set of tools to speed your IoT device development lifecycle.